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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
54020-44030LF Datasheet 54020-44030LF - Amphenol FCI 609-4705-ND CONN SOCKET PLCC 44POS TIN 4,348 - Immediate
2.03000 1 Tube?
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 100µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 100µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
8468-21A1-RK-TP Datasheet 8468-21A1-RK-TP - 3M 3M6821A1-ND CONN SOCKET PLCC 68POS TIN 1,707 - Immediate
2.16000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8468-21B1-RK-TP Datasheet 8468-21B1-RK-TP - 3M 3M6821B1-ND CONN SOCKET PLCC 68POS TIN 1,430 - Immediate
2.16000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
111-93-316-41-001000 Datasheet 111-93-316-41-001000 - Mill-Max Manufacturing Corp. ED60010-ND CONN IC DIP SOCKET 16POS GOLD 2,905 - Immediate
2.19000 1 Tube? 111 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8468-11B1-RK-TP Datasheet 8468-11B1-RK-TP - 3M 3M6811B1-ND CONN SOCKET PLCC 68POS TIN 1,626 - Immediate
2.19000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
115-43-316-41-003000 Datasheet 115-43-316-41-003000 - Mill-Max Manufacturing Corp. ED90210-ND CONN IC DIP SOCKET 16POS GOLD 1,355 - Immediate
2.22000 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-422-41-001000 Datasheet 110-93-422-41-001000 - Mill-Max Manufacturing Corp. ED3422-ND CONN IC DIP SOCKET 22POS GOLD 1,491 - Immediate
2.29000 1 Tube? 110 Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-422-41-001000 Datasheet 110-43-422-41-001000 - Mill-Max Manufacturing Corp. ED90039-ND CONN IC DIP SOCKET 22POS GOLD 1,237 - Immediate
2.29000 1 Tube? 110 Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-99-320-01-670800 Datasheet 214-99-320-01-670800 - Mill-Max Manufacturing Corp. ED2132-ND CONN IC DIP SOCKET 20POS TINLEAD 1,038 - Immediate
2.36000 1 Tube? 214 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin-Lead 100µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-628-41-001000 Datasheet 110-41-628-41-001000 - Mill-Max Manufacturing Corp. ED90520-ND CONN IC DIP SOCKET 28POS GOLD 1,264 - Immediate
2.38000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-308-31-012000 Datasheet 614-43-308-31-012000 - Mill-Max Manufacturing Corp. ED90122-ND CONN IC DIP SOCKET 8POS GOLD 1,178 - Immediate
2.39000 1 Tube? 614 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-640-41-001000 Datasheet 110-99-640-41-001000 - Mill-Max Manufacturing Corp. ED3740-ND CONN IC DIP SOCKET 40POS TINLEAD 1,126 - Immediate
2.41000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-44-320-01-670800 Datasheet 214-44-320-01-670800 - Mill-Max Manufacturing Corp. ED90240-ND CONN IC DIP SOCKET 20POS TIN 4,741 - Immediate
2.45000 1 Tube? 214 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-624-41-001000 Datasheet 110-43-624-41-001000 - Mill-Max Manufacturing Corp. ED90041-ND CONN IC DIP SOCKET 24POS GOLD 1,069 - Immediate
2.50000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR-28-HZL/01/7-TT Datasheet AR-28-HZL/01/7-TT - Assmann WSW Components AE10029-ND CONN IC DIP SOCKET 28POS GOLD 1,623 - Immediate
2.54000 1 Tube?
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Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 14 HZW/TN Datasheet AR 14 HZW/TN - Assmann WSW Components AE10047-ND CONN IC DIP SOCKET 14POS GOLD 1,112 - Immediate
2.55000 1 Tube?
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Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
917-43-108-41-005000 Datasheet 917-43-108-41-005000 - Mill-Max Manufacturing Corp. ED90275-ND CONN TRANSIST TO-5 8POS GOLD 2,627 - Immediate
2.58000 1 Tube? 917 Active Transistor, TO-5 8 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 16 HZW/TN Datasheet AR 16 HZW/TN - Assmann WSW Components AE10048-ND CONN IC DIP SOCKET 16POS GOLD 403 - Immediate
2.69000 1 Tube?
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Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR 32 HZL/01-TT Datasheet AR 32 HZL/01-TT - Assmann WSW Components AE10030-ND CONN IC DIP SOCKET 32POS GOLD 508 - Immediate
2.87000 1 Tube?
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Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
111-93-324-41-001000 Datasheet 111-93-324-41-001000 - Mill-Max Manufacturing Corp. ED60012-ND CONN IC DIP SOCKET 24POS GOLD 462 - Immediate
2.92000 1 Tube? 111 Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
540-44-020-17-400000 Datasheet 540-44-020-17-400000 - Mill-Max Manufacturing Corp. ED90025-ND CONN SOCKET PLCC 20POS TIN 1,001 - Immediate
2.95000 1 Tube? 540 Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150µin (3.81µm)
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Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150µin (3.81µm)
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Polyphenylene Sulfide (PPS)
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110-93-632-41-001000 Datasheet 110-93-632-41-001000 - Mill-Max Manufacturing Corp. ED3632-ND CONN IC DIP SOCKET 32POS GOLD 970 - Immediate
2.97000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-43-628-41-001000 Datasheet 210-43-628-41-001000 - Mill-Max Manufacturing Corp. ED90110-ND CONN IC DIP SOCKET 28POS GOLD 513 - Immediate
3.00000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6518-10 Datasheet 28-6518-10 - Aries Electronics A409AE-ND CONN IC DIP SOCKET 28POS GOLD 1,266 - Immediate
3.02000 1 Bulk? 518 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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110-13-318-41-001000 Datasheet 110-13-318-41-001000 - Mill-Max Manufacturing Corp. ED56183-ND CONN IC DIP SOCKET 18POS GOLD 2,686 - Immediate
3.04000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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13:19:30 1/19/2017