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Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
1-2199299-5 Datasheet 1-2199299-5 - TE Connectivity AMP Connectors A120355-ND 40P,DIP SKT,600 CL,LDR,PB FREE 5,568 - Immediate
0.69000 1 Bulk? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 60µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60µin (1.52µm) Nickel Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
1-2199299-2 Datasheet 1-2199299-2 - TE Connectivity AMP Connectors A120354-ND 28P,DIP SKT,600 CL,LDR,PB FREE 4,558 - Immediate
0.71000 1 Bulk? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60µin (1.52µm) Nickel Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
2-382882-1 Datasheet Photo Not Available 2-382882-1-ND CONN IC DIP SOCKET 6POS TIN 0
0.20667 7,000
Non-Stock
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Tube? Diplomate DL Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
2-382462-1 Datasheet Photo Not Available 2-382462-1-ND CONN IC DIP SOCKET 8POS TIN 0
Standard Lead Time 20 Weeks
0.28417 5,200
Non-Stock
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Tube? Diplomate DL Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin
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Beryllium Copper Thermoplastic -55°C ~ 105°C
2-382713-3 Datasheet Photo Not Available 2-382713-3-ND CONN IC DIP SOCKET 18POS TIN 0
0.43494 2,300
Non-Stock
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Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
2-382718-3 Datasheet Photo Not Available 2-382718-3-ND CONN IC DIP SOCKET 28POS TIN 0
Standard Lead Time 8 Weeks
0.47844 1,500
Non-Stock
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Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
2-641264-1 Datasheet 2-641264-1 - TE Connectivity AMP Connectors 2-641264-1-ND CONN IC DIP SOCKET 20POS TIN 0
Standard Lead Time 19 Weeks
0.48352 4,200
Non-Stock
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Tube? Diplomate DL Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin
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Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
2-382713-1 Datasheet Photo Not Available 2-382713-1-ND CONN IC DIP SOCKET 18POS TIN 0
Standard Lead Time 8 Weeks
0.48930 2,300
Non-Stock
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Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin
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Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
2-382713-8 Datasheet Photo Not Available 2-382713-8-ND CONN IC DIP SOCKET 18POS TIN 0
Standard Lead Time 8 Weeks
0.51105 2,300
Non-Stock
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Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
-
Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
2-382718-8 Datasheet Photo Not Available 2-382718-8-ND CONN IC DIP SOCKET 28POS TIN 0
Standard Lead Time 8 Weeks
0.59805 1,500
Non-Stock
?
Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin
-
Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
-
Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
2-382713-6 Datasheet Photo Not Available 2-382713-6-ND CONN IC DIP SOCKET 18POS TIN 0
0.64153 2,300
Non-Stock
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Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin
-
Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
2-382724-3 Datasheet Photo Not Available 2-382724-3-ND CONN IC DIP SOCKET 40POS TIN 0
0.68430 1,000
Non-Stock
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Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin
-
Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin
-
Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
2-641262-4 Datasheet 2-641262-4 - TE Connectivity AMP Connectors A108428-ND CONN IC DIP SOCKET 16POS GOLD 0
Standard Lead Time 13 Weeks
0.71911 1,300
Non-Stock
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Tube? Diplomate DL Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
1825374-3 Datasheet Photo Not Available 1825374-3-ND CONN IC DIP SOCKET 14POS GOLD 0
Standard Lead Time 8 Weeks
0.72055 3,000
Non-Stock
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Tube? Diplomate DL Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 15µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
2-382724-1 Datasheet Photo Not Available 2-382724-1-ND CONN IC DIP SOCKET 40POS TIN 0
0.77202 1,000
Non-Stock
?
Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin
-
Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin
-
Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
2-382724-6 Datasheet Photo Not Available 2-382724-6-ND CONN IC DIP SOCKET 40POS TIN 0
0.84815 1,000
Non-Stock
?
Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin
-
Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin
-
Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
2-640358-2 Datasheet 2-640358-2 - TE Connectivity AMP Connectors 2-640358-2-ND CONN IC DIP SOCKET 16POS GOLD 0
Standard Lead Time 5 Weeks
1.08591 2,600
Non-Stock
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Tube? Diplomate DL Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
1-1825093-4 Datasheet 1-1825093-4 - TE Connectivity AMP Connectors 1-1825093-4-ND CONN IC DIP SOCKET 16POS GOLD 0
Standard Lead Time 15 Weeks
1.10620 2,600
Non-Stock
?
Tube? Diplomate DL Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
2-641264-4 Datasheet Photo Not Available 2-641264-4-ND CONN IC DIP SOCKET 20POS GOLD 0
Standard Lead Time 19 Weeks
1.12940 420
Non-Stock
?
Tube? Diplomate DL Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 15µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
643642-6 Datasheet Photo Not Available 643642-6-ND CONN SOCKET SIP 10POS TIN 0
Standard Lead Time 12 Weeks
1.29395 880
Non-Stock
?
Tube? Diplomate DL Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin
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Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
2-382374-3 Datasheet Photo Not Available 2-382374-3-ND CONN IC DIP SOCKET 42POS TIN 0
Standard Lead Time 13 Weeks
1.30484 1,000
Non-Stock
?
Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin
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Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead
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Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
2-641267-4 Datasheet 2-641267-4 - TE Connectivity AMP Connectors 2-641267-4-ND CONN IC DIP SOCKET 28POS GOLD 0
Standard Lead Time 16 Weeks
1.45886 510
Non-Stock
?
Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 15µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
1-1825093-6 Datasheet 1-1825093-6 - TE Connectivity AMP Connectors 1-1825093-6-ND CONN IC DIP SOCKET 20POS GOLD 0
1.56289 2,100
Non-Stock
?
Tube? Diplomate DL Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
643644-8 Datasheet Photo Not Available 643644-8-ND CONN SOCKET SIP 12POS TIN 0
Standard Lead Time 15 Weeks
1.58572 720
Non-Stock
?
Tube? Diplomate DL Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin
-
Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin
-
Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
2-641615-2 Datasheet 2-641615-2 - TE Connectivity AMP Connectors A24805-ND CONN IC DIP SOCKET 28POS GOLD 0
Standard Lead Time 14 Weeks
1.60349 1,500
Non-Stock
?
Tube? Diplomate DL Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
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15:08:11 12/6/2016