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Series Part Status Process Type Flux Type Composition Wire Gauge Diameter Core Size Form Melting Point
   
SMDSWLF.031 2OZ Datasheet SMDSWLF.031 2OZ - Chip Quik Inc. SMDSWLF.031 2OZ-ND SLD WIRE NO-CLEAN 96.5/3/.5 2OZ. 106 - Immediate
11.55000 1 CHIPQUIK® Active Lead Free Wire Solder No-Clean Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) 20 AWG, 21 SWG 0.031" (0.79mm) 0.022 Spool, 57g (2 oz) 422 ~ 428°F (217 ~ 220°C)
397952 Datasheet 397952 - Multicore 82-140-ND HMP 366 3% .022DIA./24SWG 106 - Immediate
18.36000 1 366 Active Leaded Wire Solder Rosin Activated (RA) Pb93.5Sn5Ag1.5 (93.5/5/1.5) 23 AWG, 24 SWG 0.022" (0.56mm) 0.03 Spool, 227g (1/2 lb) 301 ~ 574°F (296 ~ 565°C)
04-6337-0050 Datasheet 04-6337-0050 - Kester Solder KE1602-ND SOLDR BAR ULTRAPURE 63/37 1.66LB 190 - Immediate
27.46000 1 ULTRAPURE® Active Leaded Bar Solder
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Sn63Pb37 (63/37)
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Bar, 750g (1 2/3 lbs) 361°F (183°C)
386839 Datasheet 386839 - Multicore 82-100-ND 63/37 370 3% .032DIA/21SWG 101 - Immediate
31.45000 1 370 Active Leaded Wire Solder Rosin Activated (RA) Sn63Pb37 (63/37) 20 AWG, 21 SWG 0.032" (0.81mm) 0.03 Spool, 454g (1 lb) 361°F (183°C)
395451 Datasheet 395451 - Multicore 82-127-ND 63/37 CRYSL 502 3% .032DIA/21SWG 164 - Immediate
33.46000 1 C502 Active Leaded Wire Solder No-Clean Sn63Pb37 (63/37) 20 AWG, 21 SWG 0.032" (0.81mm) 0.03 Spool, 454g (1 lb) 361°F (183°C)
395437 Datasheet 395437 - Multicore 82-141-ND HMP 366 3% .028DIA./22SWG 162 - Immediate
34.20000 1 366 Active Leaded Wire Solder Rosin Activated (RA) Pb93.5Sn5Ag1.5 (93.5/5/1.5) 21 AWG, 22 SWG 0.028" (0.71mm) 0.03 Spool, 454g (1 lb) 301 ~ 574°F (296 ~ 565°C)
24-6337-8800 Datasheet 24-6337-8800 - Kester Solder KE1400-ND SOLDER NO-CLEAN 21AWG 1LB 526 - Immediate
35.46000 1 245 Active Leaded Wire Solder No-Clean Sn63Pb37 (63/37) 20 AWG, 21 SWG 0.031" (0.79mm) 0.011 Spool, 454g (1 lb) 361°F (183°C)
24-6040-0061 Datasheet 24-6040-0061 - Kester Solder KE1104-ND SOLDER RA 60/40 14AWG 1LB 150 - Immediate
37.48000 1 44 Active Leaded Wire Solder Rosin Activated (RA) Sn60Pb40 (60/40) 14 AWG, 16 SWG 0.062" (1.57mm) 0.033 Spool, 454g (1 lb) 361 ~ 374°F (183 ~ 190°C)
24-6337-0027 Datasheet 24-6337-0027 - Kester Solder KE1102-ND SOLDER RA 21AWG 63/37 1LB 189 - Immediate
40.99000 1 44 Active Leaded Wire Solder Rosin Activated (RA) Sn63Pb37 (63/37) 20 AWG, 21 SWG 0.031" (0.79mm) 0.033 Spool, 454g (1 lb) 361°F (183°C)
24-6337-0061 Datasheet 24-6337-0061 - Kester Solder KE1100-ND SOLDER RA 16AWG 63/37 1LB 116 - Immediate
41.38000 1 44 Active Leaded Wire Solder Rosin Activated (RA) Sn63Pb37 (63/37) 14 AWG, 16 SWG 0.062" (1.57mm) 0.033 Spool, 454g (1 lb) 361°F (183°C)
24-6337-0007 Datasheet 24-6337-0007 - Kester Solder KE1110-ND SOLDER RA FLUX 28AWG 63/37 1LB 196 - Immediate
69.42000 1 44 Active Leaded Wire Solder Rosin Activated (RA) Sn63Pb37 (63/37) 26 AWG, 27 SWG 0.015" (0.39mm) 0.033 Spool, 454g (1 lb) 361°F (183°C)
24-7068-7603 Datasheet 24-7068-7603 - Kester Solder KE1131-ND SOLDER NO-CLEAN .020" 25AWG 1LB 163 - Immediate
109.30000 1 275 Active Lead Free Wire Solder No-Clean Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG 0.02" (0.51mm) 0.022 Spool, 454g (1 lb) 422 ~ 428°F (217 ~ 220°C)
24-7068-7607 Datasheet 24-7068-7607 - Kester Solder KE1134-ND SOLDER NO-CLEAN .062" 16AWG 1LB 36 - Immediate
114.47000 1 275 Active Lead Free Wire Solder No-Clean Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) 14 AWG, 16 SWG 0.062" (1.57mm) 0.022 Spool, 454g (1 lb) 422 ~ 428°F (217 ~ 220°C)
397982 Datasheet 397982 - Multicore 82-131-ND 63/37 CRYSL 502 3% .015DIA/28SWG 95 - Immediate
19.37000 1 C502 Active Leaded Wire Solder No-Clean Sn63Pb37 (63/37) 26 AWG, 27 SWG 0.015" (0.39mm) 0.03 Spool, 227g (1/2 lb) 361°F (183°C)
SMDSWLF.031 4OZ Datasheet SMDSWLF.031 4OZ - Chip Quik Inc. SMDSWLF.031 4OZ-ND SLD WIRE NO-CLEAN 96.5/3/.5 4OZ. 57 - Immediate
21.75000 1 CHIPQUIK® Active Lead Free Wire Solder No-Clean Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) 20 AWG, 21 SWG 0.031" (0.79mm) 0.022 Spool, 113g (1/4 lb) 422 ~ 428°F (217 ~ 220°C)
SMDSWLF.020 4OZ Datasheet SMDSWLF.020 4OZ - Chip Quik Inc. SMDSWLF.020 4OZ-ND SLD WIRE NO-CLEAN 96.5/3/.5 4OZ. 78 - Immediate
21.97000 1 CHIPQUIK® Active Lead Free Wire Solder No-Clean Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG 0.02" (0.51mm) 0.022 Spool, 113g (1/4 lb) 422 ~ 428°F (217 ~ 220°C)
SMD4300SNL10 Datasheet SMD4300SNL10 - Chip Quik Inc. SMD4300SNL10-ND SOLDER PASTE WATER SOL LF 10CC 29 - Immediate
26.99000 1 CHIPQUIK® Active Lead Free Solder Paste Water Soluble Sn96.5Ag3.0Cu0.5 (96.5/3/0.5)
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Syringe, 10cc, 35g (1.2 oz) 422 ~ 428°F (217 ~ 220°C)
SMD291AX10T5 Datasheet SMD291AX10T5 - Chip Quik Inc. SMD291AX10T5-ND SOLDER PASTE NO CLEAN T5 10CC 26 - Immediate
29.95000 1 CHIPQUIK® Active Leaded Solder Paste No-Clean Sn63Pb37 (63/37)
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Syringe, 10cc, 35g (1.2 oz) 361°F (183°C)
SMD291SNL10T5 Datasheet SMD291SNL10T5 - Chip Quik Inc. SMD291SNL10T5-ND SOLDER PASTE LF T5 10CC 30 - Immediate
38.95000 1 CHIPQUIK® Active Lead Free Solder Paste No-Clean Sn96.5Ag3.0Cu0.5 (96.5/3/0.5)
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Syringe, 10cc, 35g (1.2 oz) 422 ~ 428°F (217 ~ 220°C)
673828 Datasheet 673828 - Multicore 82-125-ND 97SC 400 2% .022DIA/24SWG 98 - Immediate
41.52000 1 C400™ Active Lead Free Wire Solder No-Clean Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) 23 AWG, 24 SWG 0.022" (0.56mm) 0.02 Spool, 227g (1/2 lb) 422 ~ 428°F (217 ~ 220°C)
SMD291AX250T3 Datasheet SMD291AX250T3 - Chip Quik Inc. SMD291AX250T3-ND SOLDER PASTE SN63/PB37 250G 53 - Immediate
41.95000 1 CHIPQUIK® Active Leaded Solder Paste No-Clean Sn63Pb37 (63/37)
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Jar, 250g (9 oz) 361°F (183°C)
SMD4300AX250T3 Datasheet SMD4300AX250T3 - Chip Quik Inc. SMD4300AX250T3-ND SOLDER PASTE SN63/PB37 250G 33 - Immediate
42.95000 1 SMD4300AX Active Leaded Solder Paste Water Soluble Sn63Pb37 (63/37)
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Jar, 250g (9 oz) 361°F (183°C)
SMD291SNL250T3 Datasheet SMD291SNL250T3 - Chip Quik Inc. SMD291SNL250T3-ND SOLDER PASTE SAC305 250G T3 49 - Immediate
54.95000 1 CHIPQUIK® Active Lead Free Solder Paste No-Clean Sn96.5Ag3.0Cu0.5 (96.5/3/0.5)
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Jar, 250g (9 oz) 422 ~ 428°F (217 ~ 220°C)
SMD4300SNL250T3 Datasheet SMD4300SNL250T3 - Chip Quik Inc. SMD4300SNL250T3-ND SOLDER PASTE SAC305 250G T3 20 - Immediate
55.95000 1 SMD4300AX Active Lead Free Solder Paste Water Soluble Sn96.5Ag3.0Cu0.5 (96.5/3/0.5)
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Jar, 250g (9 oz) 423 ~ 428°F (217 ~ 220°C)
SMDLTLFP250T3 Datasheet SMDLTLFP250T3 - Chip Quik Inc. SMDLTLFP250T3-ND SOLDER PASTE SN42/BI58 250G 49 - Immediate
69.95000 1 CHIPQUIK® Active Lead Free Solder Paste No-Clean Sn42Bi58 (42/58)
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Jar, 250g (9 oz) 281°F (138°C)
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12:39:24 12/10/2016