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Manufacturer Packaging Series Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
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Packaging Series Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
32-6554-10 Datasheet 32-6554-10 - Aries Electronics A304-ND CONN IC DIP SOCKET ZIF 32POS TIN 343 - Immediate
11.73000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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28-6554-10 Datasheet 28-6554-10 - Aries Electronics A302-ND CONN IC DIP SOCKET ZIF 28POS TIN 187 - Immediate
12.09000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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28-6554-11 Datasheet 28-6554-11 - Aries Electronics A303-ND CONN IC DIP SOCKET ZIF 28POS GLD 255 - Immediate
14.72000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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48-6554-10 Datasheet 48-6554-10 - Aries Electronics A308-ND CONN IC DIP SOCKET ZIF 48POS TIN 310 - Immediate
16.43000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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214-3339-00-0602J Datasheet 214-3339-00-0602J - 3M 3M1402-ND CONN IC DIP SOCKET ZIF 14POS GLD 533 - Immediate
17.81000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1275-00-0602J Datasheet 224-1275-00-0602J - 3M 3M2402-ND CONN IC DIP SOCKET ZIF 24POS GLD 198 - Immediate
19.13000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
228-1277-00-0602J Datasheet 228-1277-00-0602J - 3M 3M2802-ND CONN IC DIP SOCKET ZIF 28POS GLD 574 - Immediate
19.24000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
232-1285-00-0602J Datasheet 232-1285-00-0602J - 3M 3M5076-ND CONN IC DIP SOCKET ZIF 32POS GLD 166 - Immediate
19.26000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
218-3341-00-0602J Datasheet 218-3341-00-0602J - 3M 3M1802-ND CONN IC DIP SOCKET ZIF 18POS GLD 244 - Immediate
19.78000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
48-6554-11 Datasheet 48-6554-11 - Aries Electronics A309-ND CONN IC DIP SOCKET ZIF 48POS GLD 586 - Immediate
20.08000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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240-1280-00-0602J Datasheet 240-1280-00-0602J - 3M 3M4002-ND CONN IC DIP SOCKET ZIF 40POS GLD 178 - Immediate
21.72000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
0804MC Datasheet 0804MC - Texas Instruments 296-32607-ND CONN TRANSIST TO-3 8POS GOLD 330 - Immediate
1,800 - Factory Stock
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23.78000 1 Bulk?
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Transistor, TO-3 8 (Oval)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Polyester, Glass Filled -55°C ~ 150°C
208-7391-55-1902 Datasheet 208-7391-55-1902 - 3M 3M5054-ND CONN SOCKET SOIC 8POS GOLD 393 - Immediate
25.20000 1 Bulk? Textool™ SOIC 8 (2 x 4)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
248-1282-00-0602J Datasheet 248-1282-00-0602J - 3M 3M5004-ND CONN IC DIP SOCKET ZIF 48POS GLD 426 - Immediate
27.32000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-7224-55-1902 Datasheet 216-7224-55-1902 - 3M 3M5077-ND CONN SOCKET SOIC 16POS GOLD 405 - Immediate
28.05000 1 Bulk? Textool™ SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
216-7383-55-1902 Datasheet 216-7383-55-1902 - 3M 3M5078-ND CONN SOCKET SOIC 16POS GOLD 111 - Immediate
28.06000 1 Bulk? Textool™ SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
MS03 Datasheet MS03 - Apex Microtechnology 598-1384-ND CONN TRANSIST TO-3 8POS GOLD 467 - Immediate
29.10000 1 Bulk? Apex Precision Power® Transistor, TO-3 8 (Oval)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Polyester, Glass Filled
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240-1288-00-0602J Datasheet 240-1288-00-0602J - 3M 3M4006-ND CONN IC DIP SOCKET ZIF 40POS GLD 133 - Immediate
34.60000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
256-1292-00-0602J Datasheet 256-1292-00-0602J - 3M 3M5010-ND CONN IC DIP SOCKET ZIF 56POS GLD 117 - Immediate
35.52000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
203-2737-55-1102 Datasheet 203-2737-55-1102 - 3M 3M10849-ND CONN TRANSIST TO-3/TO-66 3POS 125 - Immediate
36.08000 1 Bulk? Textool™ Transistor, TO-3 and TO-66 3 (Rectangular)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234" (5.94mm) Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 150°C
228-7396-55-1902 Datasheet 228-7396-55-1902 - 3M 3M5059-ND CONN SOCKET SOIC 28POS GOLD 108 - Immediate
38.09000 1 Bulk? Textool™ SOIC 28 (2 x 14)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
220-2600-00-0602 Datasheet 220-2600-00-0602 - 3M 3M5062-ND CONN SOCKET SIP ZIF 20POS GOLD 223 - Immediate
38.74000 1 Bulk? Textool™ SIP, ZIF (ZIP) 20 (1 x 20) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
2-821949-5 Datasheet 2-821949-5 - TE Connectivity AMP Connectors A32368-ND CONN SOCKET PQFP 132POS TIN-LEAD 931 - Immediate
43.83000 1 Tube?
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QFP 132 (4 x 33) 0.050" (1.27mm) Tin-Lead 200µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP)
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200-6313-9UN-1900 Datasheet 200-6313-9UN-1900 - 3M 3M5068-ND CONN SOCKET PGA ZIF 169POS GOLD 113 - Immediate
44.25000 1 Bulk? Textool™ PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
169-PRS13001-12 Datasheet 169-PRS13001-12 - Aries Electronics A314-ND CONN SOCKET PGA ZIF GOLD 124 - Immediate
59.07000 1 Bulk? PRS PGA, ZIF (ZIP)
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0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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10:10:19 5/6/2016