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Manufacturer Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
224-1275-00-0602J Datasheet 224-1275-00-0602J - 3M 3M2402-ND CONN IC DIP SOCKET ZIF 24POS GLD 155 - Immediate
19.13000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-3340-00-0602J Datasheet 216-3340-00-0602J - 3M 3M1602-ND CONN IC DIP SOCKET ZIF 16POS GLD 408 - Immediate
19.19000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
48-6554-11 Datasheet 48-6554-11 - Aries Electronics A309-ND CONN IC DIP SOCKET ZIF 48POS GLD 213 - Immediate
20.94000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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240-1280-00-0602J Datasheet 240-1280-00-0602J - 3M 3M4002-ND CONN IC DIP SOCKET ZIF 40POS GLD 117 - Immediate
21.72000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1286-00-0602J Datasheet 224-1286-00-0602J - 3M 3M2406-ND CONN IC DIP SOCKET ZIF 24POS GLD 333 - Immediate
22.42000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
0804MC Datasheet 0804MC - Texas Instruments 296-32607-ND CONN TRANSIST TO-3 8POS GOLD 134 - Immediate
950 - Factory Stock
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23.78000 1 Bulk?
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Active Transistor, TO-3 8 (Oval)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Polyester, Glass Filled -55°C ~ 150°C
2201838-1 Datasheet 2201838-1 - TE Connectivity AMP Connectors A120591-ND SOCKET ASSY LGA2011-3 490 - Immediate
24.84000 1
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214-7390-55-1902 Datasheet 214-7390-55-1902 - 3M 3M5055-ND CONN SOCKET SOIC 14POS GOLD 135 - Immediate
25.68000 1 Bulk? Textool™ Active SOIC 14 (2 x 7)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
216-7224-55-1902 Datasheet 216-7224-55-1902 - 3M 3M5077-ND CONN SOCKET SOIC 16POS GOLD 288 - Immediate
28.05000 1 Bulk? Textool™ Active SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
216-7383-55-1902 Datasheet 216-7383-55-1902 - 3M 3M5078-ND CONN SOCKET SOIC 16POS GOLD 143 - Immediate
28.06000 1 Bulk? Textool™ Active SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
MS03 Datasheet MS03 - Apex Microtechnology 598-1384-ND CONN TRANSIST TO-3 8POS GOLD 610 - Immediate
29.10000 1 Bulk? Apex Precision Power® Active Transistor, TO-3 8 (Oval)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Polyester, Glass Filled
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256-1292-00-0602J Datasheet 256-1292-00-0602J - 3M 3M5010-ND CONN IC DIP SOCKET ZIF 56POS GLD 161 - Immediate
35.52000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
203-2737-55-1102 Datasheet 203-2737-55-1102 - 3M 3M10849-ND CONN TRANSIST TO-3/TO-66 3POS 246 - Immediate
36.08000 1 Bulk? Textool™ Active Transistor, TO-3 and TO-66 3 (Rectangular)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234" (5.94mm) Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 150°C
228-7396-55-1902 Datasheet 228-7396-55-1902 - 3M 3M5059-ND CONN SOCKET SOIC 28POS GOLD 234 - Immediate
38.09000 1 Bulk? Textool™ Active SOIC 28 (2 x 14)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
2-821949-5 Datasheet 2-821949-5 - TE Connectivity AMP Connectors A32368-ND CONN SOCKET PQFP 132POS TIN-LEAD 308 - Immediate
39.87000 1 Tube?
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Active QFP 132 (4 x 33) 0.050" (1.27mm) Tin-Lead 200µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP)
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200-6310-9UN-1900 Datasheet 200-6310-9UN-1900 - 3M 3M5066-ND CONN SOCKET PGA ZIF 100POS GOLD 222 - Immediate
43.16000 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 100 (10 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
200-6313-9UN-1900 Datasheet 200-6313-9UN-1900 - 3M 3M5068-ND CONN SOCKET PGA ZIF 169POS GOLD 191 - Immediate
44.25000 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
200-6311-9UN-1900 Datasheet 200-6311-9UN-1900 - 3M 3M5067-ND CONN SOCKET PGA ZIF 121POS GOLD 97 - Immediate
44.33000 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 121 (11 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
200-6317-9UN-1900 Datasheet 200-6317-9UN-1900 - 3M 3M5070-ND CONN SOCKET PGA ZIF 289POS GOLD 110 - Immediate
55.49000 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 289 (17 x 17) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
169-PRS13001-12 Datasheet 169-PRS13001-12 - Aries Electronics A314-ND CONN SOCKET PGA ZIF GOLD 168 - Immediate
61.64000 1 Bulk? PRS Active PGA, ZIF (ZIP)
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0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
225-PRS15001-12 Datasheet 225-PRS15001-12 - Aries Electronics A315-ND CONN SOCKET PGA ZIF GOLD 122 - Immediate
68.46000 1 Bulk? PRS Active PGA, ZIF (ZIP)
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0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
289-PRS17001-12 Datasheet 289-PRS17001-12 - Aries Electronics A316-ND CONN SOCKET PGA ZIF GOLD 61 - Immediate
79.98000 1 Bulk? PRS Active PGA, ZIF (ZIP)
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0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
248-5205-01 Datasheet 248-5205-01 - 3M 3M10840-ND CONN SOCKET QFN 48POS GOLD 41 - Immediate
90.78000 1 Bulk? Textool™ Active QFN 48 (4 x 12) 0.020" (0.50mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold
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Beryllium Copper Polyethersulfone (PES)
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200-6321-9UN-1900 Datasheet 200-6321-9UN-1900 - 3M 3M5072-ND CONN SOCKET PGA ZIF 441POS GOLD 30 - Immediate
92.46000 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 441 (21 x 21) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
264-5205-01 Datasheet 264-5205-01 - 3M 3M10833-ND CONN SOCKET QFN 64POS GOLD 48 - Immediate
101.80000 1 Bulk? Textool™ Active QFN 64 (4 x 16) 0.020" (0.50mm) Gold
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Beryllium Copper Through Hole Open Frame Solder 0.020" (0.50mm) Gold
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Beryllium Copper Polyethersulfone (PES)
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Results per Page
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14:15:07 12/7/2016