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Packaging Series Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
TDU03DTOD Datasheet TDU03DTOD - Sullins Connector Solutions S9633-ND CONN SOCKET TRANSIST 3POS GOLD 278 - Immediate
10.56000 1 Bulk?
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Transistor 3 (Rectangular)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Board Guide, Flange Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -55°C ~ 175°C
28-6554-10 Datasheet 28-6554-10 - Aries Electronics A302-ND CONN IC DIP SOCKET ZIF 28POS TIN 288 - Immediate
10.96000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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32-6554-10 Datasheet 32-6554-10 - Aries Electronics A304-ND CONN IC DIP SOCKET ZIF 32POS TIN 555 - Immediate
12.22000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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48-6554-10 Datasheet 48-6554-10 - Aries Electronics A308-ND CONN IC DIP SOCKET ZIF 48POS TIN 300 - Immediate
14.55000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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40-6554-10 Datasheet 40-6554-10 - Aries Electronics A306-ND CONN IC DIP SOCKET ZIF 40POS TIN 230 - Immediate
14.58000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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28-6554-11 Datasheet 28-6554-11 - Aries Electronics A303-ND CONN IC DIP SOCKET ZIF 28POS GLD 632 - Immediate
15.33000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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214-3339-00-0602J Datasheet 214-3339-00-0602J - 3M 3M1402-ND CONN IC DIP SOCKET ZIF 14POS GLD 134 - Immediate
17.81000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
220-3342-00-0602J Datasheet 220-3342-00-0602J - 3M 3M2002-ND CONN IC DIP SOCKET ZIF 20POS GLD 641 - Immediate
18.94000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1275-00-0602J Datasheet 224-1275-00-0602J - 3M 3M2402-ND CONN IC DIP SOCKET ZIF 24POS GLD 482 - Immediate
19.13000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-3340-00-0602J Datasheet 216-3340-00-0602J - 3M 3M1602-ND CONN IC DIP SOCKET ZIF 16POS GLD 422 - Immediate
19.19000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
228-1277-00-0602J Datasheet 228-1277-00-0602J - 3M 3M2802-ND CONN IC DIP SOCKET ZIF 28POS GLD 264 - Immediate
19.24000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
232-1285-00-0602J Datasheet 232-1285-00-0602J - 3M 3M5076-ND CONN IC DIP SOCKET ZIF 32POS GLD 147 - Immediate
19.26000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
218-3341-00-0602J Datasheet 218-3341-00-0602J - 3M 3M1802-ND CONN IC DIP SOCKET ZIF 18POS GLD 195 - Immediate
19.78000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
48-6554-11 Datasheet 48-6554-11 - Aries Electronics A309-ND CONN IC DIP SOCKET ZIF 48POS GLD 560 - Immediate
20.94000 1 Bulk? 55 DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
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Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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240-1280-00-0602J Datasheet 240-1280-00-0602J - 3M 3M4002-ND CONN IC DIP SOCKET ZIF 40POS GLD 327 - Immediate
21.72000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1286-00-0602J Datasheet 224-1286-00-0602J - 3M 3M2406-ND CONN IC DIP SOCKET ZIF 24POS GLD 144 - Immediate
22.42000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
0804MC Datasheet 0804MC - Texas Instruments 296-32607-ND CONN TRANSIST TO-3 8POS GOLD 296 - Immediate
1,350 - Factory Stock
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23.78000 1 Bulk?
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Transistor, TO-3 8 (Oval)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Polyester, Glass Filled -55°C ~ 150°C
208-7391-55-1902 Datasheet 208-7391-55-1902 - 3M 3M5054-ND CONN SOCKET SOIC 8POS GOLD 323 - Immediate
25.20000 1 Bulk? Textool™ SOIC 8 (2 x 4)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
216-7224-55-1902 Datasheet 216-7224-55-1902 - 3M 3M5077-ND CONN SOCKET SOIC 16POS GOLD 361 - Immediate
28.05000 1 Bulk? Textool™ SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
216-7383-55-1902 Datasheet 216-7383-55-1902 - 3M 3M5078-ND CONN SOCKET SOIC 16POS GOLD 293 - Immediate
28.06000 1 Bulk? Textool™ SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
MS03 Datasheet MS03 - Apex Microtechnology 598-1384-ND CONN TRANSIST TO-3 8POS GOLD 733 - Immediate
29.10000 1 Bulk? Apex Precision Power® Transistor, TO-3 8 (Oval)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Polyester, Glass Filled
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232-1287-00-0602J Datasheet 232-1287-00-0602J - 3M 3M5005-ND CONN IC DIP SOCKET ZIF 32POS GLD 174 - Immediate
29.38000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
240-1288-00-0602J Datasheet 240-1288-00-0602J - 3M 3M4006-ND CONN IC DIP SOCKET ZIF 40POS GLD 129 - Immediate
34.60000 1 Bulk? Textool™ DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
203-2737-55-1102 Datasheet 203-2737-55-1102 - 3M 3M10849-ND CONN TRANSIST TO-3/TO-66 3POS 209 - Immediate
36.08000 1 Bulk? Textool™ Transistor, TO-3 and TO-66 3 (Rectangular)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234" (5.94mm) Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 150°C
220-2600-00-0602 Datasheet 220-2600-00-0602 - 3M 3M5062-ND CONN SOCKET SIP ZIF 20POS GOLD 123 - Immediate
38.74000 1 Bulk? Textool™ SIP, ZIF (ZIP) 20 (1 x 20) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
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09:07:22 6/30/2016