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Packaging Series Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
110-41-640-41-001000 Datasheet 110-41-640-41-001000 - Mill-Max Manufacturing Corp. ED90522-ND CONN IC DIP SOCKET 40POS GOLD 936 - Immediate
2.91000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
A-CCS68-G Datasheet A-CCS68-G - Assmann WSW Components AE10066-ND CONN SOCKET PLCC 68POS GOLD 657 - Immediate
2.96000 1 Tube?
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PLCC 68 (4 x 17) 0.050" (1.27mm) Gold
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Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Gold
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Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
110-43-632-41-001000 Datasheet 110-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90043-ND CONN IC DIP SOCKET 32POS GOLD 1,327 - Immediate
2.97000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-314-41-001000 Datasheet 123-93-314-41-001000 - Mill-Max Manufacturing Corp. ED4314-ND CONN IC DIP SOCKET 14POS GOLD 2,384 - Immediate
3.07000 1 Tube? 123 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-43-632-41-001000 Datasheet 210-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90111-ND CONN IC DIP SOCKET 32POS GOLD 621 - Immediate
3.43000 1 Tube? 210 DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6518-10 Datasheet 40-6518-10 - Aries Electronics A411-ND CONN IC DIP SOCKET 40POS GOLD 1,780 - Immediate
3.57000 1 Bulk? 518 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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110-43-640-41-001000 Datasheet 110-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90044-ND CONN IC DIP SOCKET 40POS GOLD 2,591 - Immediate
3.71000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-41-001000 Datasheet 110-93-640-41-001000 - Mill-Max Manufacturing Corp. ED3640-ND CONN IC DIP SOCKET 40POS GOLD 1,751 - Immediate
3.71000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0513-10 Datasheet 25-0513-10 - Aries Electronics A208-ND CONN SOCKET SIP 25POS GOLD 1,513 - Immediate
4.15000 1 Bulk? 0513 SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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40-0518-10 Datasheet 40-0518-10 - Aries Electronics A460-ND CONN SOCKET SIP 40POS GOLD 1,596 - Immediate
4.23000 1 Bulk? 518 SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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210-43-640-41-001000 Datasheet 210-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90112-ND CONN IC DIP SOCKET 40POS GOLD 224 - Immediate
4.29000 1 Tube? 210 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-1571994-0 Datasheet 1-1571994-0 - TE Connectivity AMP Connectors 1-1571994-0-ND CONN SOCKET SIP 10POS GOLD 1,828 - Immediate
4.75000 1 Bulk? 510 SIP 10 (1 x 10) 0.100" (2.54mm) Gold 20µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20µin (0.51µm) Copper Thermoplastic, Polyester
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110-43-320-41-801000 Datasheet 110-43-320-41-801000 - Mill-Max Manufacturing Corp. ED90185-ND CONN IC DIP SOCKET 20POS GOLD 309 - Immediate
5.02000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-312-11-001000 Datasheet 299-93-312-11-001000 - Mill-Max Manufacturing Corp. ED58434-ND CONN IC DIP SOCKET 12POS GOLD 1,879 - Immediate
5.19000 1 Tube? 299 DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-324-41-801000 Datasheet 110-43-324-41-801000 - Mill-Max Manufacturing Corp. ED90186-ND CONN IC DIP SOCKET 24POS GOLD 966 - Immediate
5.69000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-312-10-001000 Datasheet 299-43-312-10-001000 - Mill-Max Manufacturing Corp. ED90136-ND CONN IC DIP SOCKET 12POS GOLD 406 - Immediate
5.79000 1 Tube? 299 DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-314-10-001000 Datasheet 299-93-314-10-001000 - Mill-Max Manufacturing Corp. ED58411-ND CONN IC DIP SOCKET 14POS GOLD 769 - Immediate
5.92000 1 Tube? 299 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-0518-11 Datasheet 40-0518-11 - Aries Electronics A461-ND CONN SOCKET SIP 40POS GOLD 598 - Immediate
6.15000 1 Bulk? 518 SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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20-0511-10 Datasheet 20-0511-10 - Aries Electronics A201-ND CONN SOCKET SIP 20POS TIN 2,378 - Immediate
6.21000 1 Bulk? 511 SIP 20 (1 x 20) 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Through Hole
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Solder 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
117-93-642-41-005000 Datasheet 117-93-642-41-005000 - Mill-Max Manufacturing Corp. ED22426-ND CONN IC DIP SOCKET 42POS GOLD 989 - Immediate
6.61000 1 Tube? 117 DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-314-10-001000 Datasheet 299-43-314-10-001000 - Mill-Max Manufacturing Corp. ED90137-ND CONN IC DIP SOCKET 14POS GOLD 2,118 - Immediate
6.70000 1 Tube? 299 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-C182-10 Datasheet 28-C182-10 - Aries Electronics A528-ND CONN IC DIP SOCKET 28POS GOLD 940 - Immediate
7.11000 1 Bulk? EJECT-A-DIP™ DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-2810-90T Datasheet 10-2810-90T - Aries Electronics A788AR-ND CONN IC DIP SOCKET 10POS TIN 5,340 - Immediate
7.88000 1 Bulk? Vertisockets™ 800 DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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14-810-90R Datasheet 14-810-90R - Aries Electronics A116-ND CONN IC DIP SOCKET 14POS TIN 664 - Immediate
8.28000 1 Bulk? Vertisockets™ 800 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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28-526-10 Datasheet 28-526-10 - Aries Electronics A347-ND CONN IC DIP SOCKET ZIF 28POS TIN 2,662 - Immediate
10.47000 1 Bulk? Lo-PRO®file, 526 DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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05:59:21 6/29/2016