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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
110-41-640-41-001000 Datasheet 110-41-640-41-001000 - Mill-Max Manufacturing Corp. ED90522-ND CONN IC DIP SOCKET 40POS GOLD 1,509 - Immediate
2.91000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
A-CCS68-G Datasheet A-CCS68-G - Assmann WSW Components AE10066-ND CONN SOCKET PLCC 68POS GOLD 1,748 - Immediate
2.96000 1 Tube?
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Active PLCC 68 (4 x 17) 0.050" (1.27mm) Gold
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Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Gold
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Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
110-43-632-41-001000 Datasheet 110-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90043-ND CONN IC DIP SOCKET 32POS GOLD 1,240 - Immediate
2.97000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-43-632-41-001000 Datasheet 210-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90111-ND CONN IC DIP SOCKET 32POS GOLD 2,217 - Immediate
3.43000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6518-10 Datasheet 40-6518-10 - Aries Electronics A411-ND CONN IC DIP SOCKET 40POS GOLD 2,030 - Immediate
3.57000 1 Bulk? 518 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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110-43-640-41-001000 Datasheet 110-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90044-ND CONN IC DIP SOCKET 40POS GOLD 3,069 - Immediate
3.71000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-41-001000 Datasheet 110-93-640-41-001000 - Mill-Max Manufacturing Corp. ED3640-ND CONN IC DIP SOCKET 40POS GOLD 1,709 - Immediate
3.71000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0513-10 Datasheet 25-0513-10 - Aries Electronics A208-ND CONN SOCKET SIP 25POS GOLD 163 - Immediate
4.15000 1 Bulk? 0513 Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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40-0518-10 Datasheet 40-0518-10 - Aries Electronics A460-ND CONN SOCKET SIP 40POS GOLD 1,760 - Immediate
4.23000 1 Bulk? 518 Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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210-43-640-41-001000 Datasheet 210-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90112-ND CONN IC DIP SOCKET 40POS GOLD 2,414 - Immediate
4.29000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-1571994-0 Datasheet 1-1571994-0 - TE Connectivity AMP Connectors 1-1571994-0-ND CONN SOCKET SIP 10POS GOLD 1,555 - Immediate
4.79000 1 Bulk? 510 Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 20µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20µin (0.51µm) Copper Thermoplastic, Polyester
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110-43-320-41-801000 Datasheet 110-43-320-41-801000 - Mill-Max Manufacturing Corp. ED90185-ND CONN IC DIP SOCKET 20POS GOLD 539 - Immediate
5.02000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-312-11-001000 Datasheet 299-93-312-11-001000 - Mill-Max Manufacturing Corp. ED58434-ND CONN IC DIP SOCKET 12POS GOLD 1,476 - Immediate
5.19000 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-312-10-001000 Datasheet 299-43-312-10-001000 - Mill-Max Manufacturing Corp. ED90136-ND CONN IC DIP SOCKET 12POS GOLD 401 - Immediate
5.79000 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-314-10-001000 Datasheet 299-93-314-10-001000 - Mill-Max Manufacturing Corp. ED58411-ND CONN IC DIP SOCKET 14POS GOLD 820 - Immediate
5.92000 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-0518-11 Datasheet 40-0518-11 - Aries Electronics A461-ND CONN SOCKET SIP 40POS GOLD 572 - Immediate
6.15000 1 Bulk? 518 Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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20-0511-10 Datasheet 20-0511-10 - Aries Electronics A201-ND CONN SOCKET SIP 20POS TIN 2,378 - Immediate
6.21000 1 Bulk? 511 Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Through Hole
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Solder 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
117-93-642-41-005000 Datasheet 117-93-642-41-005000 - Mill-Max Manufacturing Corp. ED22426-ND CONN IC DIP SOCKET 42POS GOLD 1,366 - Immediate
6.61000 1 Tube? 117 Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-314-10-001000 Datasheet 299-43-314-10-001000 - Mill-Max Manufacturing Corp. ED90137-ND CONN IC DIP SOCKET 14POS GOLD 3,822 - Immediate
6.70000 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
10-2810-90T Datasheet 10-2810-90T - Aries Electronics A788AR-ND CONN IC DIP SOCKET 10POS TIN 5,318 - Immediate
7.88000 1 Bulk? Vertisockets™ 800 Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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40-C182-10 Datasheet 40-C182-10 - Aries Electronics A540-ND CONN IC DIP SOCKET 40POS GOLD 377 - Immediate
8.19000 1 Bulk? EJECT-A-DIP™ Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-810-90R Datasheet 14-810-90R - Aries Electronics A116-ND CONN IC DIP SOCKET 14POS TIN 907 - Immediate
8.28000 1 Bulk? Vertisockets™ 800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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28-526-10 Datasheet 28-526-10 - Aries Electronics A347-ND CONN IC DIP SOCKET ZIF 28POS TIN 2,526 - Immediate
10.47000 1 Bulk? Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
TDU03DTOD Datasheet TDU03DTOD - Sullins Connector Solutions S9633-ND CONN SOCKET TRANSIST 3POS GOLD 228 - Immediate
10.56000 1 Bulk?
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Active Transistor 3 (Rectangular)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Board Guide, Flange Solder
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Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -55°C ~ 175°C
28-6554-10 Datasheet 28-6554-10 - Aries Electronics A302-ND CONN IC DIP SOCKET ZIF 28POS TIN 263 - Immediate
10.96000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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01:24:23 8/27/2016