Product Index  >  Connectors, Interconnects  >  Sockets for ICs, Transistors

Results: 1,279       1,279 Remaining
Manufacturer Packaging Series Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear

   1,279 Remaining
Results per Page
Page 4/52
|< 2 3 4 5 6 >|
?
Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
?
Unit Price
USD ?
Minimum Quantity
?
Packaging Series Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
110-43-628-41-001000 Datasheet 110-43-628-41-001000 - Mill-Max Manufacturing Corp. ED90042-ND CONN IC DIP SOCKET 28POS GOLD 2,493 - Immediate
2.91000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-328-41-001000 Datasheet 110-93-328-41-001000 - Mill-Max Manufacturing Corp. ED3328-ND CONN IC DIP SOCKET 28POS GOLD 2,078 - Immediate
2.91000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-640-41-001000 Datasheet 110-41-640-41-001000 - Mill-Max Manufacturing Corp. ED90522-ND CONN IC DIP SOCKET 40POS GOLD 978 - Immediate
2.91000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
A-CCS68-G Datasheet A-CCS68-G - Assmann WSW Components AE10066-ND CONN SOCKET PLCC 68POS GOLD 1,083 - Immediate
2.96000 1 Tube?
-
PLCC 68 (4 x 17) 0.050" (1.27mm) Gold
-
Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Gold
-
Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
110-43-632-41-001000 Datasheet 110-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90043-ND CONN IC DIP SOCKET 32POS GOLD 1,110 - Immediate
2.97000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 20-HZW/TN Datasheet AR 20-HZW/TN - Assmann WSW Components AE10050-ND CONN IC DIP SOCKET 20POS GOLD 463 - Immediate
3.37000 1 Tube?
-
DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold
-
Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
40-6518-10 Datasheet 40-6518-10 - Aries Electronics A411-ND CONN IC DIP SOCKET 40POS GOLD 1,944 - Immediate
3.41000 1 Bulk? 518 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
210-43-632-41-001000 Datasheet 210-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90111-ND CONN IC DIP SOCKET 32POS GOLD 1,037 - Immediate
3.43000 1 Tube? 210 DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-640-41-001000 Datasheet 110-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90044-ND CONN IC DIP SOCKET 40POS GOLD 2,990 - Immediate
3.71000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-41-001000 Datasheet 110-93-640-41-001000 - Mill-Max Manufacturing Corp. ED3640-ND CONN IC DIP SOCKET 40POS GOLD 1,855 - Immediate
3.71000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0513-10 Datasheet 25-0513-10 - Aries Electronics A208-ND CONN SOCKET SIP 25POS GOLD 1,624 - Immediate
3.99000 1 Bulk? 0513 SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole
-
Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
40-0518-10 Datasheet 40-0518-10 - Aries Electronics A460-ND CONN SOCKET SIP 40POS GOLD 938 - Immediate
4.08000 1 Bulk? 518 SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
210-43-640-41-001000 Datasheet 210-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90112-ND CONN IC DIP SOCKET 40POS GOLD 1,740 - Immediate
4.29000 1 Tube? 210 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
16-C280-10 Datasheet 16-C280-10 - Aries Electronics A516-ND CONN IC DIP SOCKET 16POS GOLD 363 - Immediate
4.69000 1 Bulk? EJECT-A-DIP™ DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-43-320-41-801000 Datasheet 110-43-320-41-801000 - Mill-Max Manufacturing Corp. ED90185-ND CONN IC DIP SOCKET 20POS GOLD 834 - Immediate
5.02000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-312-11-001000 Datasheet 299-93-312-11-001000 - Mill-Max Manufacturing Corp. ED58434-ND CONN IC DIP SOCKET 12POS GOLD 592 - Immediate
5.19000 1 Tube? 299 DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-312-10-001000 Datasheet 299-43-312-10-001000 - Mill-Max Manufacturing Corp. ED90136-ND CONN IC DIP SOCKET 12POS GOLD 406 - Immediate
5.79000 1 Tube? 299 DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-0518-11 Datasheet 40-0518-11 - Aries Electronics A461-ND CONN SOCKET SIP 40POS GOLD 602 - Immediate
5.90000 1 Bulk? 518 SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-0511-10 Datasheet 20-0511-10 - Aries Electronics A201-ND CONN SOCKET SIP 20POS TIN 2,578 - Immediate
5.93000 1 Bulk? 511 SIP 20 (1 x 20) 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Through Hole
-
Solder 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-13-640-41-001000 Datasheet 110-13-640-41-001000 - Mill-Max Manufacturing Corp. ED56406-ND CONN IC DIP SOCKET 40POS GOLD 671 - Immediate
6.03000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-314-10-001000 Datasheet 299-43-314-10-001000 - Mill-Max Manufacturing Corp. ED90137-ND CONN IC DIP SOCKET 14POS GOLD 979 - Immediate
6.70000 1 Tube? 299 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-C182-10 Datasheet 28-C182-10 - Aries Electronics A528-ND CONN IC DIP SOCKET 28POS GOLD 941 - Immediate
6.89000 1 Bulk? EJECT-A-DIP™ DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-2810-90T Datasheet 10-2810-90T - Aries Electronics A788AR-ND CONN IC DIP SOCKET 10POS TIN 5,340 - Immediate
7.55000 1 Bulk? Vertisockets™ 800 DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
-
28-526-10 Datasheet 28-526-10 - Aries Electronics A347-ND CONN IC DIP SOCKET ZIF 28POS TIN 2,772 - Immediate
10.02000 1 Bulk? Lo-PRO®file, 526 DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
TDU03DTOD Datasheet TDU03DTOD - Sullins Connector Solutions S9633-ND CONN SOCKET TRANSIST 3POS GOLD 152 - Immediate
10.56000 1 Bulk?
-
Transistor 3 (Rectangular)
-
Gold 30µin (0.76µm) Beryllium Copper Through Hole Board Guide, Flange Solder
-
Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -55°C ~ 175°C
Results per Page
Page 4/52
|< 2 3 4 5 6 >|

21:13:17 5/28/2016