Product Index  >  Connectors, Interconnects  >  Sockets for ICs, Transistors

Results: 10,702       10,702 Remaining
Manufacturer Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear

   10,702 Remaining
Results per Page
Page 4/429
|< 2 3 4 5 6 >|
?
Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
?
Unit Price
USD
?
Minimum Quantity
?
Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
110-93-328-41-001000 Datasheet 110-93-328-41-001000 - Mill-Max Manufacturing Corp. ED3328-ND CONN IC DIP SOCKET 28POS GOLD 1,465 - Immediate
2.91000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
A-CCS68-G Datasheet A-CCS68-G - Assmann WSW Components AE10066-ND CONN SOCKET PLCC 68POS GOLD 2,166 - Immediate
2.96000 1 Tube?
-
Active PLCC 68 (4 x 17) 0.050" (1.27mm) Gold
-
Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Gold
-
Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
110-43-632-41-001000 Datasheet 110-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90043-ND CONN IC DIP SOCKET 32POS GOLD 275 - Immediate
2.97000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-6518-10 Datasheet 32-6518-10 - Aries Electronics A410AE-ND CONN IC DIP SOCKET 32POS GOLD 2,546 - Immediate
3.07000 1 Bulk? 518 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
210-43-632-41-001000 Datasheet 210-43-632-41-001000 - Mill-Max Manufacturing Corp. ED90111-ND CONN IC DIP SOCKET 32POS GOLD 2,104 - Immediate
3.43000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6518-10 Datasheet 40-6518-10 - Aries Electronics A411-ND CONN IC DIP SOCKET 40POS GOLD 1,207 - Immediate
3.57000 1 Bulk? 518 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
110-43-640-41-001000 Datasheet 110-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90044-ND CONN IC DIP SOCKET 40POS GOLD 1,940 - Immediate
3.71000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-41-001000 Datasheet 110-93-640-41-001000 - Mill-Max Manufacturing Corp. ED3640-ND CONN IC DIP SOCKET 40POS GOLD 948 - Immediate
3.71000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0513-10 Datasheet 25-0513-10 - Aries Electronics A208-ND CONN SOCKET SIP 25POS GOLD 2,759 - Immediate
4.15000 1 Bulk? 0513 Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole
-
Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
40-0518-10 Datasheet 40-0518-10 - Aries Electronics A460-ND CONN SOCKET SIP 40POS GOLD 1,520 - Immediate
4.23000 1 Bulk? 518 Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
210-43-640-41-001000 Datasheet 210-43-640-41-001000 - Mill-Max Manufacturing Corp. ED90112-ND CONN IC DIP SOCKET 40POS GOLD 2,207 - Immediate
4.29000 1 Tube? 210 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-320-41-801000 Datasheet 110-43-320-41-801000 - Mill-Max Manufacturing Corp. ED90185-ND CONN IC DIP SOCKET 20POS GOLD 1,389 - Immediate
5.02000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-312-11-001000 Datasheet 299-93-312-11-001000 - Mill-Max Manufacturing Corp. ED58434-ND CONN IC DIP SOCKET 12POS GOLD 1,324 - Immediate
5.19000 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
20-0511-10 Datasheet 20-0511-10 - Aries Electronics A201-ND CONN SOCKET SIP 20POS TIN 1,835 - Immediate
6.21000 1 Bulk? 511 Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Through Hole
-
Solder 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
299-43-314-10-001000 Datasheet 299-43-314-10-001000 - Mill-Max Manufacturing Corp. ED90137-ND CONN IC DIP SOCKET 14POS GOLD 1,920 - Immediate
6.70000 1 Tube? 299 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
14-810-90R Datasheet 14-810-90R - Aries Electronics A116-ND CONN IC DIP SOCKET 14POS TIN 806 - Immediate
8.28000 1 Bulk? Vertisockets™ 800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 50µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
-
28-526-10 Datasheet 28-526-10 - Aries Electronics A347-ND CONN IC DIP SOCKET ZIF 28POS TIN 2,408 - Immediate
10.47000 1 Bulk? Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
TDU03DTON Datasheet TDU03DTON - Sullins Connector Solutions S9634-ND CONN SOCKET TRANSIST 3POS GOLD 359 - Immediate
10.56000 1 Bulk?
-
Active Transistor 3 (Rectangular)
-
Gold 30µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder
-
Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -55°C ~ 175°C
TDU03DTOD Datasheet TDU03DTOD - Sullins Connector Solutions S9633-ND CONN SOCKET TRANSIST 3POS GOLD 104 - Immediate
10.56000 1 Bulk?
-
Active Transistor 3 (Rectangular)
-
Gold 30µin (0.76µm) Beryllium Copper Through Hole Board Guide, Flange Solder
-
Gold 30µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -55°C ~ 175°C
28-6554-10 Datasheet 28-6554-10 - Aries Electronics A302-ND CONN IC DIP SOCKET ZIF 28POS TIN 155 - Immediate
10.96000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
-
32-6554-10 Datasheet 32-6554-10 - Aries Electronics A304-ND CONN IC DIP SOCKET ZIF 32POS TIN 804 - Immediate
12.22000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
-
24-6554-11 Datasheet 24-6554-11 - Aries Electronics A301AE-ND CONN IC DIP SOCKET ZIF 24POS GLD 429 - Immediate
14.14000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold
-
Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
-
Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
-
48-6554-10 Datasheet 48-6554-10 - Aries Electronics A308-ND CONN IC DIP SOCKET ZIF 48POS TIN 324 - Immediate
14.55000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
-
40-6554-10 Datasheet 40-6554-10 - Aries Electronics A306-ND CONN IC DIP SOCKET ZIF 40POS TIN 154 - Immediate
14.58000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
-
28-6554-11 Datasheet 28-6554-11 - Aries Electronics A303-ND CONN IC DIP SOCKET ZIF 28POS GLD 536 - Immediate
15.33000 1 Bulk? 55 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold
-
Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold
-
Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
-
Results per Page
Page 4/429
|< 2 3 4 5 6 >|

12:58:40 12/8/2016