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Manufacturer Packaging Series Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
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Packaging Series Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
110-99-314-41-001000 Datasheet 110-99-314-41-001000 - Mill-Max Manufacturing Corp. ED3114-ND CONN IC DIP SOCKET 14POS TINLEAD 3,224 - Immediate
0.98000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 18 HZL-TT Datasheet AR 18 HZL-TT - Assmann WSW Components AE10014-ND CONN IC DIP SOCKET 18POS TIN 7,795 - Immediate
0.99000 1 Tube?
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DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS-044-Z-T Datasheet A-CCS-044-Z-T - Assmann WSW Components AE10057-ND CONN SOCKET PLCC 44POS TIN 32,822 - Immediate
1.02000 1 Tube?
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PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
8432-21B1-RK-TR Datasheet 8432-21B1-RK-TR - 3M 3M3221B1TR-ND CONN SOCKET PLCC 32POS TIN 2,700 - Immediate
1.15900 450 Tape & Reel (TR)?
Alternate Packaging
8400 PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8432-21B1-RK-TR Datasheet 8432-21B1-RK-TR - 3M 3M3221B1CT-ND CONN SOCKET PLCC 32POS TIN 3,068 - Immediate
1.81000 1 Cut Tape (CT)?
Alternate Packaging
8400 PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8432-21B1-RK-TR Datasheet 8432-21B1-RK-TR - 3M 3M3221B1DKR-ND CONN SOCKET PLCC 32POS TIN 3,068 - Immediate
Digi-Reel® 1 Digi-Reel®?
Alternate Packaging
8400 PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
08-3518-10 Datasheet 08-3518-10 - Aries Electronics A400-ND CONN IC DIP SOCKET 8POS GOLD 11,590 - Immediate
1.20000 1 Bulk? 518 DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1TR-ND CONN SOCKET PLCC 44POS TIN 2,520 - Immediate
1.38700 360 Tape & Reel (TR)?
Alternate Packaging
8400 PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1CT-ND CONN SOCKET PLCC 44POS TIN 3,113 - Immediate
2.17000 1 Cut Tape (CT)?
Alternate Packaging
8400 PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1DKR-ND CONN SOCKET PLCC 44POS TIN 3,113 - Immediate
Digi-Reel® 1 Digi-Reel®?
Alternate Packaging
8400 PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8432-11B1-RK-TP Datasheet 8432-11B1-RK-TP - 3M 3M3211B1-ND CONN SOCKET PLCC 32POS TIN 2,558 - Immediate
1.40000 1 Tube? 8400 PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A-CCS-068-Z-T Datasheet A-CCS-068-Z-T - Assmann WSW Components AE10059-ND CONN SOCKET PLCC 68POS TIN 2,377 - Immediate
1.42000 1 Tube?
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PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
940-44-032-17-400000 Datasheet 940-44-032-17-400000 - Mill-Max Manufacturing Corp. ED90014-ND CONN SOCKET PLCC 32POS TIN 6,447 - Immediate
1.46000 1 Tube? 940 PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 28 HZL-TT Datasheet AR 28 HZL-TT - Assmann WSW Components AE10017-ND CONN IC DIP SOCKET 28POS TIN 3,616 - Immediate
1.47000 1 Tube?
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DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin
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Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
14-3518-10 Datasheet 14-3518-10 - Aries Electronics A401-ND CONN IC DIP SOCKET 14POS GOLD 3,795 - Immediate
1.56000 1 Bulk? 518 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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110-13-308-41-001000 Datasheet 110-13-308-41-001000 - Mill-Max Manufacturing Corp. ED56083-ND CONN IC DIP SOCKET 8POS GOLD 2,238 - Immediate
1.58000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8444-21B1-RK-TP Datasheet 8444-21B1-RK-TP - 3M 3M4421B1-ND CONN SOCKET PLCC 44POS TIN 2,817 - Immediate
1.65000 1 Tube? 8400 PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-93-316-41-001000 Datasheet 110-93-316-41-001000 - Mill-Max Manufacturing Corp. ED3316-ND CONN IC DIP SOCKET 16POS GOLD 8,432 - Immediate
1.66000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-316-41-001000 Datasheet 110-43-316-41-001000 - Mill-Max Manufacturing Corp. ED90034-ND CONN IC DIP SOCKET 16POS GOLD 3,874 - Immediate
1.66000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-328-41-001000 Datasheet 110-44-328-41-001000 - Mill-Max Manufacturing Corp. ED90054-ND CONN IC DIP SOCKET 28POS TIN 3,580 - Immediate
1.68000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-628-41-001000 Datasheet 110-44-628-41-001000 - Mill-Max Manufacturing Corp. ED90057-ND CONN IC DIP SOCKET 28POS TIN 3,455 - Immediate
1.68000 1 Tube? 110 DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-328-41-001000 Datasheet 110-99-328-41-001000 - Mill-Max Manufacturing Corp. ED3128-ND CONN IC DIP SOCKET 28POS TINLEAD 2,224 - Immediate
1.68000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-424-41-001000 Datasheet 110-44-424-41-001000 - Mill-Max Manufacturing Corp. ED90055-ND CONN IC DIP SOCKET 24POS TIN 2,755 - Immediate
1.69000 1 Tube? 110 DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-314-41-001000 Datasheet 110-93-314-41-001000 - Mill-Max Manufacturing Corp. ED3314-ND CONN IC DIP SOCKET 14POS GOLD 4,494 - Immediate
1.70000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-314-41-001000 Datasheet 110-43-314-41-001000 - Mill-Max Manufacturing Corp. ED90033-ND CONN IC DIP SOCKET 14POS GOLD 2,189 - Immediate
1.70000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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15:05:21 7/29/2016