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Manufacturer Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
8444-21A1-RK-TP Datasheet 8444-21A1-RK-TP - 3M 3M4421A1-ND CONN SOCKET PLCC 44POS TIN 1,575 - Immediate
1.65000 1 Tube? 8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
917-93-103-41-005000 Datasheet 917-93-103-41-005000 - Mill-Max Manufacturing Corp. ED2150-ND CONN TRANSIST TO-5 3POS GOLD 1,487 - Immediate
1.65000 1 Tube? 917 Active Transistor, TO-5 3 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-316-41-001000 Datasheet 110-41-316-41-001000 - Mill-Max Manufacturing Corp. ED90517-ND CONN IC DIP SOCKET 16POS GOLD 1,089 - Immediate
1.66000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-99-314-01-670800 Datasheet 214-99-314-01-670800 - Mill-Max Manufacturing Corp. ED2129-ND CONN IC DIP SOCKET 14POS TINLEAD 4,562 - Immediate
1.68000 1 Tube? 214 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin-Lead 100µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-43-314-41-001000 Datasheet 210-43-314-41-001000 - Mill-Max Manufacturing Corp. ED90106-ND CONN IC DIP SOCKET 14POS GOLD 1,521 - Immediate
1.68000 1 Tube? 210 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-624-41-001000 Datasheet 110-44-624-41-001000 - Mill-Max Manufacturing Corp. ED90056-ND CONN IC DIP SOCKET 24POS TIN 1,635 - Immediate
1.69000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-324-41-001000 Datasheet 110-44-324-41-001000 - Mill-Max Manufacturing Corp. ED90053-ND CONN IC DIP SOCKET 24POS TIN 1,216 - Immediate
1.69000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
4-1571552-2 Datasheet 4-1571552-2 - TE Connectivity AMP Connectors 4-1571552-2-ND CONN IC DIP SOCKET 14POS GOLD 4,537 - Immediate
1.70000 1 Tube? 800 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 20µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
110-41-320-41-001000 Datasheet 110-41-320-41-001000 - Mill-Max Manufacturing Corp. ED90519-ND CONN IC DIP SOCKET 20POS GOLD 1,418 - Immediate
1.70000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
08-2513-10 Datasheet 08-2513-10 - Aries Electronics A776AR-ND CONN IC DIP SOCKET 8POS GOLD 2,650 - Immediate
1.76000 1 Bulk? Lo-PRO®file, 513 Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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917-93-104-41-005000 Datasheet 917-93-104-41-005000 - Mill-Max Manufacturing Corp. ED2151-ND CONN TRANSIST TO-5 4POS GOLD 1,249 - Immediate
1.79000 1 Tube? 917 Active Transistor, TO-5 4 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-314-41-003000 Datasheet 115-93-314-41-003000 - Mill-Max Manufacturing Corp. ED5314-ND CONN IC DIP SOCKET 14POS GOLD 1,147 - Immediate
1.79000 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
506-AG11D-ESL-LF Datasheet 506-AG11D-ESL-LF - TE Connectivity AMP Connectors A105216-ND CONN IC DIP SOCKET 6POS GOLD 1,674 - Immediate
1.83000 1 Tube? 500 Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8452-11B1-RK-TP Datasheet 8452-11B1-RK-TP - 3M 3M5211B1-ND CONN SOCKET PLCC 52POS TIN 1,270 - Immediate
1.86000 1 Tube? 8400 Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-43-314-10-001000 Datasheet 110-43-314-10-001000 - Mill-Max Manufacturing Corp. ED90428-ND CONN IC DIP SOCKET 14POS GOLD 1,266 - Immediate
1.87000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-318-41-001000 Datasheet 110-93-318-41-001000 - Mill-Max Manufacturing Corp. ED3318-ND CONN IC DIP SOCKET 18POS GOLD 1,030 - Immediate
1.87000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-43-103-41-005000 Datasheet 917-43-103-41-005000 - Mill-Max Manufacturing Corp. ED90273-ND CONN TRANSIST TO-5 3POS GOLD 6,522 - Immediate
1.89000 1 Tube? 917 Active Transistor, TO-5 3 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-44-314-01-670800 Datasheet 214-44-314-01-670800 - Mill-Max Manufacturing Corp. ED90237-ND CONN IC DIP SOCKET 14POS TIN 2,003 - Immediate
1.89000 1 Tube? 214 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-632-41-001000 Datasheet 110-99-632-41-001000 - Mill-Max Manufacturing Corp. ED3732-ND CONN IC DIP SOCKET 32POS TINLEAD 1,257 - Immediate
1.92000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
69802-144LF Datasheet 69802-144LF - Amphenol FCI 609-3481-ND CONN SOCKET PLCC 44POS TIN 3,470 - Immediate
1.94000 1 Tube?
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Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
115-43-314-41-003000 Datasheet 115-43-314-41-003000 - Mill-Max Manufacturing Corp. ED90209-ND CONN IC DIP SOCKET 14POS GOLD 1,714 - Immediate
1.96000 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8468-21B1-RK-TP Datasheet 8468-21B1-RK-TP - 3M 3M6821B1-ND CONN SOCKET PLCC 68POS TIN 1,430 - Immediate
2.16000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
18-3518-10 Datasheet 18-3518-10 - Aries Electronics A403AE-ND CONN IC DIP SOCKET 18POS GOLD 1,298 - Immediate
2.18000 1 Bulk? 518 Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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8468-11B1-RK-TP Datasheet 8468-11B1-RK-TP - 3M 3M6811B1-ND CONN SOCKET PLCC 68POS TIN 1,693 - Immediate
2.19000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-93-422-41-001000 Datasheet 110-93-422-41-001000 - Mill-Max Manufacturing Corp. ED3422-ND CONN IC DIP SOCKET 22POS GOLD 972 - Immediate
2.29000 1 Tube? 110 Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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16:30:51 12/10/2016