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Packaging Series Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
110-44-324-41-001000 Datasheet 110-44-324-41-001000 - Mill-Max Manufacturing Corp. ED90053-ND CONN IC DIP SOCKET 24POS TIN 2,235 - Immediate
1.69000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
4-1571552-2 Datasheet 4-1571552-2 - TE Connectivity AMP Connectors 4-1571552-2-ND CONN IC DIP SOCKET 14POS GOLD 4,825 - Immediate
1.70000 1 Tube? 800 DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 20µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
110-41-320-41-001000 Datasheet 110-41-320-41-001000 - Mill-Max Manufacturing Corp. ED90519-ND CONN IC DIP SOCKET 20POS GOLD 3,137 - Immediate
1.70000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
08-2513-10 Datasheet 08-2513-10 - Aries Electronics A776AR-ND CONN IC DIP SOCKET 8POS GOLD 3,480 - Immediate
1.76000 1 Bulk? Lo-PRO®file, 513 DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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16-3518-10 Datasheet 16-3518-10 - Aries Electronics A402AE-ND CONN IC DIP SOCKET 16POS GOLD 1,298 - Immediate
1.76000 1 Bulk? 518 DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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917-93-104-41-005000 Datasheet 917-93-104-41-005000 - Mill-Max Manufacturing Corp. ED2151-ND CONN TRANSIST TO-5 4POS GOLD 1,566 - Immediate
1.79000 1 Tube? 917 Transistor, TO-5 4 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8452-11B1-RK-TP Datasheet 8452-11B1-RK-TP - 3M 3M5211B1-ND CONN SOCKET PLCC 52POS TIN 1,658 - Immediate
1.86000 1 Tube? 8400 PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-41-318-41-001000 Datasheet 110-41-318-41-001000 - Mill-Max Manufacturing Corp. ED90518-ND CONN IC DIP SOCKET 18POS GOLD 1,620 - Immediate
1.86000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-318-41-001000 Datasheet 110-93-318-41-001000 - Mill-Max Manufacturing Corp. ED3318-ND CONN IC DIP SOCKET 18POS GOLD 1,809 - Immediate
1.87000 1 Tube? 110 DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-43-103-41-001000 Datasheet 917-43-103-41-001000 - Mill-Max Manufacturing Corp. ED90421-ND CONN TRANSIST TO-5 3POS GOLD 1,247 - Immediate
1.87000 1 Tube? 917 Transistor, TO-5 3 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder
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Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-43-103-41-005000 Datasheet 917-43-103-41-005000 - Mill-Max Manufacturing Corp. ED90273-ND CONN TRANSIST TO-5 3POS GOLD 8,328 - Immediate
1.89000 1 Tube? 917 Transistor, TO-5 3 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
69802-044LF Datasheet 69802-044LF - Amphenol FCI 609-3480-ND CONN SOCKET PLCC 44POS TIN 1,380 - Immediate
1.93000 1 Tube?
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PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
69802-144LF Datasheet 69802-144LF - Amphenol FCI 609-3481-ND CONN SOCKET PLCC 44POS TIN 4,021 - Immediate
1.94000 1 Tube?
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PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
917-43-104-41-005000 Datasheet 917-43-104-41-005000 - Mill-Max Manufacturing Corp. ED90274-ND CONN TRANSIST TO-5 4POS GOLD 2,019 - Immediate
2.01000 1 Tube? 917 Transistor, TO-5 4 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-316-41-003000 Datasheet 115-93-316-41-003000 - Mill-Max Manufacturing Corp. ED5316-ND CONN IC DIP SOCKET 16POS GOLD 1,281 - Immediate
2.05000 1 Tube? 115 DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-93-108-41-005000 Datasheet 917-93-108-41-005000 - Mill-Max Manufacturing Corp. ED2152-ND CONN TRANSIST TO-5 8POS GOLD 1,169 - Immediate
2.08000 1 Tube? 917 Transistor, TO-5 8 (Round)
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Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
10-2513-10 Datasheet 10-2513-10 - Aries Electronics 10-2513-10-ND CONN IC DIP SOCKET 10POS GOLD 2,448 - Immediate
2.15000 1 Bulk? Lo-PRO®file, 513 DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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BU080Z-178-HT Datasheet BU080Z-178-HT - On Shore Technology Inc. ED2202-ND CONN IC DIP SOCKET 8POS GOLD 1,625 - Immediate
2.15000 1 Tube? BU-178HT DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
18-3518-10 Datasheet 18-3518-10 - Aries Electronics A403AE-ND CONN IC DIP SOCKET 18POS GOLD 1,072 - Immediate
2.18000 1 Bulk? 518 DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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111-93-316-41-001000 Datasheet 111-93-316-41-001000 - Mill-Max Manufacturing Corp. ED60010-ND CONN IC DIP SOCKET 16POS GOLD 3,982 - Immediate
2.19000 1 Tube? 111 DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8468-11B1-RK-TP Datasheet 8468-11B1-RK-TP - 3M 3M6811B1-ND CONN SOCKET PLCC 68POS TIN 1,833 - Immediate
2.19000 1 Tube? 8400 PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
115-43-316-41-003000 Datasheet 115-43-316-41-003000 - Mill-Max Manufacturing Corp. ED90210-ND CONN IC DIP SOCKET 16POS GOLD 2,021 - Immediate
2.22000 1 Tube? 115 DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-422-41-001000 Datasheet 110-43-422-41-001000 - Mill-Max Manufacturing Corp. ED90039-ND CONN IC DIP SOCKET 22POS GOLD 1,662 - Immediate
2.29000 1 Tube? 110 DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-422-41-001000 Datasheet 110-93-422-41-001000 - Mill-Max Manufacturing Corp. ED3422-ND CONN IC DIP SOCKET 22POS GOLD 1,641 - Immediate
2.29000 1 Tube? 110 DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8484-21B1-RK-TP Datasheet 8484-21B1-RK-TP - 3M 3M8421B1-ND CONN SOCKET PLCC 84POS TIN 1,315 - Immediate
2.35000 1 Tube? 8400 PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
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22:59:33 7/1/2016