Product Index  >  Connectors, Interconnects  >  Sockets for ICs, Transistors

Results: 10,700       10,700 Remaining
Manufacturer Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear Clear

   10,700 Remaining
Results per Page
Page 11/428
|< 9 10 11 12 13 >|
?
Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
?
Unit Price
USD
?
Minimum Quantity
?
Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
16-3518-10 Datasheet 16-3518-10 - Aries Electronics A402AE-ND CONN IC DIP SOCKET 16POS GOLD 1,590 - Immediate
1.76000 1 Bulk? 518 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
917-93-104-41-005000 Datasheet 917-93-104-41-005000 - Mill-Max Manufacturing Corp. ED2151-ND CONN TRANSIST TO-5 4POS GOLD 1,904 - Immediate
1.79000 1 Tube? 917 Active Transistor, TO-5 4 (Round)
-
Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
-
Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
506-AG11D-ESL-LF Datasheet 506-AG11D-ESL-LF - TE Connectivity AMP Connectors A105216-ND CONN IC DIP SOCKET 6POS GOLD 1,762 - Immediate
1.83000 1 Tube? 500 Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8452-11B1-RK-TP Datasheet 8452-11B1-RK-TP - 3M 3M5211B1-ND CONN SOCKET PLCC 52POS TIN 1,314 - Immediate
1.86000 1 Tube? 8400 Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-43-314-10-001000 Datasheet 110-43-314-10-001000 - Mill-Max Manufacturing Corp. ED90428-ND CONN IC DIP SOCKET 14POS GOLD 1,268 - Immediate
1.87000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-43-103-41-005000 Datasheet 917-43-103-41-005000 - Mill-Max Manufacturing Corp. ED90273-ND CONN TRANSIST TO-5 3POS GOLD 7,992 - Immediate
1.89000 1 Tube? 917 Active Transistor, TO-5 3 (Round)
-
Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
-
Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-44-314-01-670800 Datasheet 214-44-314-01-670800 - Mill-Max Manufacturing Corp. ED90237-ND CONN IC DIP SOCKET 14POS TIN 2,055 - Immediate
1.89000 1 Tube? 214 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-93-316-41-001000 Datasheet 210-93-316-41-001000 - Mill-Max Manufacturing Corp. ED60002-ND CONN IC DIP SOCKET 16POS GOLD 2,152 - Immediate
1.92000 1 Tube? 210 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
69802-144LF Datasheet 69802-144LF - Amphenol FCI 609-3481-ND CONN SOCKET PLCC 44POS TIN 3,603 - Immediate
1.94000 1 Tube?
-
Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
115-93-316-41-001000 Datasheet 115-93-316-41-001000 - Mill-Max Manufacturing Corp. ED58163-ND CONN IC DIP SOCKET 16POS GOLD 1,132 - Immediate
2.07000 1 Tube? 115 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-93-108-41-005000 Datasheet 917-93-108-41-005000 - Mill-Max Manufacturing Corp. ED2152-ND CONN TRANSIST TO-5 8POS GOLD 1,292 - Immediate
2.08000 1 Tube? 917 Active Transistor, TO-5 8 (Round)
-
Gold 30µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
-
Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
10-2513-10 Datasheet 10-2513-10 - Aries Electronics 10-2513-10-ND CONN IC DIP SOCKET 10POS GOLD 2,332 - Immediate
2.15000 1 Bulk? Lo-PRO®file, 513 Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
10-3513-10 Datasheet 10-3513-10 - Aries Electronics A793AR-ND CONN IC DIP SOCKET 10POS GOLD 1,453 - Immediate
2.15000 1 Bulk? Lo-PRO®file, 513 Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
-
BU080Z-178-HT Datasheet BU080Z-178-HT - On Shore Technology Inc. ED2202-ND CONN IC DIP SOCKET 8POS GOLD 1,377 - Immediate
2.15000 1 Tube? BU-178HT Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
8468-11B1-RK-TP Datasheet 8468-11B1-RK-TP - 3M 3M6811B1-ND CONN SOCKET PLCC 68POS TIN 1,129 - Immediate
2.19000 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-43-314-10-002000 Datasheet 110-43-314-10-002000 - Mill-Max Manufacturing Corp. ED90431-ND CONN IC DIP SOCKET 14POS GOLD 1,261 - Immediate
2.27000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-422-41-001000 Datasheet 110-43-422-41-001000 - Mill-Max Manufacturing Corp. ED90039-ND CONN IC DIP SOCKET 22POS GOLD 1,317 - Immediate
2.29000 1 Tube? 110 Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-422-41-001000 Datasheet 110-93-422-41-001000 - Mill-Max Manufacturing Corp. ED3422-ND CONN IC DIP SOCKET 22POS GOLD 1,197 - Immediate
2.29000 1 Tube? 110 Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
A-CCS32-G Datasheet A-CCS32-G - Assmann WSW Components AE10063-ND CONN SOCKET PLCC 32POS GOLD 1,699 - Immediate
2.40000 1 Tube?
-
Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Gold
-
Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Gold
-
Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
110-99-640-41-001000 Datasheet 110-99-640-41-001000 - Mill-Max Manufacturing Corp. ED3740-ND CONN IC DIP SOCKET 40POS TINLEAD 1,507 - Immediate
2.41000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-44-320-01-670800 Datasheet 214-44-320-01-670800 - Mill-Max Manufacturing Corp. ED90240-ND CONN IC DIP SOCKET 20POS TIN 2,493 - Immediate
2.45000 1 Tube? 214 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-324-41-001000 Datasheet 110-93-324-41-001000 - Mill-Max Manufacturing Corp. ED3324-ND CONN IC DIP SOCKET 24POS GOLD 1,009 - Immediate
2.50000 1 Tube? 110 Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
D01-9973242 Datasheet D01-9973242 - Harwin Inc. 952-1938-ND CONN SOCKET SIP 32POS GOLD 1,153 - Immediate
2.50000 1 Bulk? D01-997 Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole
-
Solder 0.100" (2.54mm) Tin 196.8µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled -55°C ~ 125°C
110-43-624-41-001000 Datasheet 110-43-624-41-001000 - Mill-Max Manufacturing Corp. ED90041-ND CONN IC DIP SOCKET 24POS GOLD 1,094 - Immediate
2.50000 1 Tube? 110 Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR-28-HZL/01/7-TT Datasheet AR-28-HZL/01/7-TT - Assmann WSW Components AE10029-ND CONN IC DIP SOCKET 28POS GOLD 1,705 - Immediate
2.54000 1 Tube?
-
Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
Results per Page
Page 11/428
|< 9 10 11 12 13 >|

12:14:43 9/29/2016