Z-PACK TinMan Connector System
High Density Backplane Connectors
The TE Connectivity Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high-performance backplane interconnect system.
The Z-PACK TinMan connector design follows proven industry backplane convention by offering a fully protected right-angle receptacle for use on daughter cards where handling damage can be a concern when mating to a vertical male header. This connector permits field repairability at either the module or single-pin levels.
Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high throughput performance levels. Reliability is provided with a dual point of contact mating interface and compliant pin interface to the printed circuit board.
TinMan Receptacle Assemblies | View All
TinMan Header Assemblies | View All