Innovative Circuit Protection Solutions
TE continues to be a key supplier of innovative circuit protection solutions and a leader in PolySwitch PPTC (polymeric positive temperature coefficient) resettable device technology to customers worldwide. TE's extensive catalog of circuit protection products help prevent overcurrent and overvoltage faults, such as a short, power cross or surge, to keep your devices running longer.
TE's circuit protection products are a part of your everyday life. To date, billions of TE's circuit protection products have been used to help protect a wide range of products in the portable electronics, automotive, industrial appliance and telecommunication markets.
Integrated Overcurrent/Overvoltage Protection Devices
The 2Pro product is an integrated overcurrent/overvoltage protection device. The RoHS-compliant component incorporates PolySwitch PPTC technology and MOV (Metal Oxide Varistor) technology in a single device to help reduce board space requirements and component count.
Damage to telephony communications equipment can be caused by various sources including lightning, electrostatic discharge (ESD), power contact and induction with AC lines. The 2Pro TM2P-10271 device helps provide current limiting during overcurrent events and voltage clamping during overvoltage events. After a fault condition is removed and power is cycled, the 2Pro device will reset so that the equipment remains operational.
The 2Pro device helps address the need for resettable circuit protection devices for use in cost-sensitive PSTN (Public Switched Telephone Network) and VoIP (Voice over Internet Protocol) telephony equipment. The widespread use of VoIP gateways in homes and enterprise environments as the primary means of voice delivery requires the utmost safety and reliability in equipment.
POLYZEN DEVICES POLYMER PROTECTED ZENER DIODE
PolyZen devices are polymer-enhanced, precision Zener diode micro-assemblies. They offer resettable protection against multi-Watt fault events without the need for multi-Watt heat sinks.
The Zener diode used for voltage clamping a PolyZen micro-assembly was selected due to its relatively flat voltage versus current response. This helps improve output voltage clamping, even when input voltage is high and diode currents are large.
An advanced feature of the PolyZen micro-assembly is that the Zener diode is thermally coupled to a resistively non-linear, PPTC layer. This PPTC layer is fully integrated into the device and is electrically in series between VIN and the diode clamped VOUT.
This advanced PPTC layer responds to either extended diode heating or overcurrent events by transitioning from a low to high resistance state, also known as “tripping.” A tripped PPTC will limit current and generate voltage drop. This helps to protect both the Zener diode and the follow-on electronics and effectively increases the diode’s power handling capability.
The PolyZen device's polymer-enhanced Zener diode helps protect sensitive portable electronics from damage caused by inductive voltage spikes, voltage transients, incorrect power supplies and reverse bias. These devices are particularly suitable for portable electronics and other low-power DC electronics.
Overcurrent Protection Devices
SURFACE-MOUNT FUSES: PULSE TOLERANT CHIP FUSES
Pulse Tolerant Chip fuses have high inrush current withstand capability and provide overcurrent protection for DC power systems. The combination of the devices' silver fusing element and monolithic, multilayer design result in strong arc suppression characteristics.
These RoHS-compliant surface-mount devices can help facilitate the development of more reliable, high-performance consumer electronics such as laptops, multimedia devices, cell phones and other portable electronics.
SURFACE-MOUNT FUSES: 0603 VERY FAST-ACTING CHIP FUSES
Very fast-acting chip fuses help provide overcurrent protection for systems using DC power sources up to 32VDC. The fuse’s monolithic, multilayer design helps provide the highest hold current in the smallest footprint, reduce diffusion-related aging, improve product reliability and resilience, and enhance high-temperature performance in a wide range of circuit designs.
These RoHS-compliant surface-mount devices offer strong arc suppression characteristics and facilitate the development of more reliable, high-performance consumer electronics such as laptops, multimedia devices, cell phones and other portable electronics.
SURFACE-MOUNT FUSES: FAST-ACTING CHIP FUSES
Fast-acting chip fuses help provide overcurrent protection for systems using DC power sources up to 63VDC. The fuse’s monolithic, multilayer design helps provide the highest hold current in the smallest footprint, reduce diffusion- related aging, improve product reliability and resilience and enhance high-temperature performance in a wide range of circuit designs.
The RoHS-compliant surface-mount devices' strong arc suppression characteristics help facilitate the development of more reliable, high-performance consumer electronics such as laptops, multimedia devices, cell phones and other portable electronics.
SURFACE-MOUNT FUSES: HIGH-CURRENT-RATED CHIP FUSES
The monolithic multilayer design of TE Circuit Protection's high-current-rated chip fuses helps to provide some of the highest current ratings available in the 1206 size and enhances high-temperature performance in a wide range of circuit protection designs. The devices’ small size, high reliability and strong arc suppression characteristics make them suitable for overcurrent protection of power supplies, servers, communications equipment, voltage regulator modules and other high-current, small size applications.
SURFACE-MOUNT FUSES: SLOW-BLOW CHIP FUSES
Available in industry standard 1206 and 0603 chip sizes, TE Circuit Protection’s slow-blow chip fuses help provide overcurrent protection on systems that experience large and frequent current surges as part of their normal operation. The slow-blow chip fuse’s monolithic, multilayer design helps provide some of the highest current ratings available in the 1206 and 0603 footprints and enhances high-temperature performance in a wide range of circuit protection designs. The devices’ small size, high reliability and strong arc suppression characteristics make them suitable for overcurrent protection of power supplies, capacitor filter banks, Liquid Crystal Display (LCD) backlight inverters, electric motors and portable electronics.
SURFACE-MOUNT FUSES: 2410 VERY FAST-ACTING FUSES
The 2410 (6125mm) Wire-in-Air (WIA) SMD Fuse is suitable for secondary-level overcurrent protection applications.
These lead-free surface-mount devices offer increased reliability and avoid the risk of end caps falling off. Their straight wire element in air performs consistent fusing and cutting characteristics.
Overvoltage Protection Devices
GAS DISCHARGE TUBES (GDTs)
TE Circuit Protection’s GDTs (Gas Discharge Tubes) are placed in front of, and in parallel with, sensitive telecom equipment such as power lines, communication lines, signal lines and data transmission lines to help protect them from damage caused by transient surge voltages that may result from lightning strikes and equipment switching operations. These devices do not influence the signal in normal operation. However, in the event of an overvoltage surge, such as a lightning strike, the GDT switches to a low impedance state and diverts the energy away from the sensitive equipment.
Our GDTs offer a high level of surge protection, a broad voltage range, low capacitance and many form factors, including new surface mount devices, which make them suitable for applications such as Main Distribution Frame (MDF) modules, high data-rate telecom applications (e.g., ADSL, VDSL) and surge protection on power lines. Their low capacitance also results in less signal distortion. When used in a coordinated circuit protection solution with PolySwitch devices, they can help equipment manufacturers meet stringent safety regulatory standards.
Thermal Protection Devices
MHP WITH THERMAL ACTIVATION
The rapidly expanding market for ultra-thin portable electronic devices, such as media tablets and ultra-thin PCs, has created demand for very thin, low-profile, lightweight and high-capacity Lithium Polymer (LiP) and prismatic cells.
A new MHP (Metal Hybrid PPTC) device, the MHP-TA device, offers a 9VDC rating and a higher current rating than typical battery strap devices. This helps them meet the battery safety requirements of higher-capacity LiP and prismatic batteries found in the latest tablet and ultra-thin computing products. Hybrid MHP technology connects a bimetal protector in parallel with a PPTC (polymeric positive temperature coefficient) device.
The resulting MHP-TA (Thermal Activation) series helps provide resettable overtemperature protection, while utilizing the PPTC device to act as a heater and to help keep the bimetal latched until the fault is removed.
ESD Protection Devices
TE Circuit Protection’s Polymer ESD (PESD) line of devices helps protect I/O ports on HDMI 1.3, portable video players, LCD and plasma TVs, USB 2.0, digital visual interface (DVI) and antenna switches. PESD devices shunt electrostatic discharge away from sensitive circuitry in HDTV equipment, printers, laptops, cellular phones and other portable devices.
PESD devices offer many advantages over traditional protection devices, such as multi layer varistors (MLVs), which may degrade or distort the signal in high data rate circuits. Compared to transient voltage suppression (TVS) diodes and miniature gas discharge tubes (GDTs), PESD devices provide a more compact form factor and an economical solution for the shrinking profiles of today’s compact information appliances.
Available in a range of form factors, our PESD devices provide low capacitance and meet transmission line pulse (TLP) testing, as well as IEC61000-4-2 testing.
TE Circuit Protection’s ChipSESD family of Silicon ESD devices, available in EIA-0201 and EIA-0602 sized rectangular SMT passive component packages, can help protect electronic circuits against damage from electrostatic discharge (ESD) events.
The ChipSESD devices are high-capacitance, bi-directional devices that can be used for low-speed generic interfaces such as keypads, power buttons, speakers and microphone ports in a portable electronics. The bi-directional operation eliminates orientation constraints and the need for polarity inspections. The surface mount technology (SMT) passive component package allows the devices to be easily installed onto the printed circuit board using the standard PCB assembly process. Once soldered onto the boards, the ChipSESD device’s solder fillets at the end terminals can easily be visually inspected.
The ChipSESD devices offer 10kV contact and 16kV air discharge protection per the IEC61000-4-2, level 4 standard with a surge rating of 2A under 8x20µs pulse.
SINGLE-CHANNEL SILICON ESD DEVICES
Silicon ESD (SESD) devices help provide protection and improve reliability for applications including consumer, portable and mobile electronics. The 0402- and 0201-sized devices have low capacitance of 0.10pF for bidirectional devices and 0.20pF for uni-directional devices with low insertion loss. This helps provide protection for high-speed data signals. The single-channel SESD devices provide robust ESD protection with industry-leading 20kV contacts and air discharge ratings per IEC61000-4-2 standard. The ultra-low capacitance enables signal integrity for today’s highestspeed interfaces including USB 3.0/2.0, HDMI, eSATA, DisplayPort and Thunderbolt.
TE Circuit Protection offers the single-channel devices in uni-directional and bi-directional configurations. Bi-directional devices offer the lowest capacitance and insertion loss, allow placement on the PCB without orientation constraint and do not clip signals that swing below ground. Unidirectional devices offer a low negative breakover voltage and help provide protection for high-speed digital interfaces. The 0201-sized XDFN small footprint — measuring a mere 0.6mm x 0.3mm x 0.31mm — offers designers placement flexibility in space-constrained applications.
MULTI-CHANNEL SILICON ESD FLOW-THROUGH ARRAYS
SESD arrays can help provide protection and improve reliability of electronics in applications including but not limited to consumer, portable and mobile electronics. The multi-channel SESD flow-through arrays have low capacitance of 0.20pF with low insertion loss, which help protect highspeed data signals. The SESD arrays provide robust ESD protection with 20kV contact and air discharge rating per the IEC61000-4-2 standard. The low capacitance SESD arrays enable signal integrity for today’s highestspeed interfaces including USB 3.0/2.0, HDMI, eSATA, DisplayPort and Thunderbolt.
TE offers four- and six-channel miniature arrays which are up to 85% smaller than common multi-channel arrays for space-constrained applications. TE’s ultrasmall packages have lower parasitic impedance which reduces insertion loss at high frequencies compared to larger-packaged devices. All of our SESD arrays are in flow-through design packages which allow for matched impedance PCB trace routing essential for high-speed signal integrity.
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