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Multi-Position Backplane RF Modules


Modular, high density, blind-mate connection system from TE Connectivity


TE Connectivity's multi-position backplane RF module is a modular, high density, blind-mate RF backplane connection system combining a high performance, broad bandwidth multi-position RF interconnect in a customer configurable platform. Datasheet

TE Connectivity's Multi-Position Backplane RF Modules
Features
  • Float mounted jack maintains positive RF ground
  • .240 center-to-center spacing
  • High channel to channel isolation
  • RF contacts are available for a variety of low loss cables
  • Compliant pin backplane contacts are available
  • RF cable assembly capability
  • 4 and 8 position modules are designed to meet the requirements of VITA 67.1 and VITA 67.2
  • Modular design permits application specific configuration with high RF contact count

Applications
  • Land and sea anti-ballistic signal processing
  • Central computing, satellite on-board and ship-
    board computing
  • Ground base stations and communication systems
  • Backplane/daughter card applications
  • Avionics and ground based radar systems
  • UAV electronic sensing and processing
  • Electronic countermeasure systems

Digi-Key P/N Manufacturer P/N Description
A103876-ND 1996883-3 CONN HOUSING 4 POS VITA 67
A103875-ND 1996884-1 CONN ASSY 4 POS COAX VITA 67
A103872-ND 1996705-3 CONN HOUSING 8 POS VITA 67
A103873-ND 1996706-1 CONN ASSY 8 POS COAX VITA 67
A103874-ND 1996390-1 CONN PIN CONTACT GOLD
A103871-ND 1996771-1 CONN PIN CONTACT GOLD
View all TE VITA conforming product