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Tflex™ 700 Series

5 W/mK soft gap filler thermal interface material from Laird Thermal

Laird Thermal's Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Tflex 700’s unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex 700 is naturally tacky and requires no additional adhesive coating to inhibit thermal performance. Tflex 700 is electrically insulating and stable from -45°C thru 200°C. It also meets UL 94V0 flame rating. Datasheet Tflex™ 700 Series

Applications Features
  • Cooling components to chassis, frame, or other mating components
  • Mass storage devices
  • Heat pipe thermal solutions for notebook computers
  • Automotive engine control
  • Telecommunication hardware
  • LED solid state lighting
  • Power electronics
  • Flat panel displays
  • Audio and video components
  • Computer servers and other IT infrastructure
  • GPS navigation and other portable devices
  • Thermal conductivity 5.0 W/mK
  • Highly compliant
  • Lowest thermal resistance even at low pressure
  • Available in thicknesses from 0.020" - 0.200" (0.5 mm - 5.0 mm)
  • Naturally tacky for adhesion during assembly
    and transport

  • RoHS Compliant

Digi-Key P/N Manufacturer P/N Description
926-1142-ND A15896-02 TFLEX 720 9X9"
926-1143-ND A15896-04 TFLEX 740 9X9"
926-1144-ND A15796-26 TFLEX 780 9X9"
926-1145-ND A15796-27 TFLEX 7100 9X9"
926-1146-ND A15896-12 TFLEX 7120 9X9"
926-1147-ND A15896-16 TFLEX 7160 9X9"
926-1148-ND A15796-28 TFLEX 7200 9X9"