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Tflex™ 200 V0 Series

Soft, free standing gap filler from Laird Thermal

Laird Thermal's Tflex™ 200 V0s are a series of soft, free standing gap filler that is more compressible than most gap fillers. Tflex 200 V0 combines good thermal conductivity of 1.1 W/mK with high conformability to produce low thermal resistance. The alumina filler allows Tflex 200 V0 to remain a cost effective solution where moderate thermal performance is acceptable. Tflex 200 V0 is naturally tacky and does not need an additional adhesive coating that can inhibit thermal performance. Tflex 200 V0 is electrically insulating, stable from -40°C to 160°C and meets the UL 94 V0 rating. Datasheet

Tflex™ 200 V0 Series
Features Applications
  • Soft and compressible for low stress applications
  • Naturally tacky needing no further adhesive coating
  • 1.1 W/mK thermal conductivity
  • Available in thicknesses from 0.010” (0.25 mm) to 0.200” (5.0 mm)
  • Cooling components to the chassis or frame
  • High speed mass storage drives
  • RDRAM memory modules
  • Heat pipe thermal solutions
  • Automotive engine control units
  • Wireless communication hardware

Digi-Key P/N Manufacturer P/N Description
926-1114-ND A14162-25 TFLEX 220V0 9X9"
926-1115-ND A14162-27 TFLEX 240V0 9X9"
926-1116-ND A14162-06 TFLEX 280V0 9X9"
926-1117-ND A14162-15 TFLEX 2100V0 9X9"
926-1118-ND A14162-33 TFLEX 2120V0 9X9"
926-1119-ND A10198-11 TFLEX 2160V0 9X9"