Laird Technologies - Thermal Products Supplier Page

Tflex SF600D Series



Compliant silicone-free 2.8-3.0 W/mK thermally conductive gap filler


Laird Technologies' Tflex™ SF600 DF is a high performance, silicone-free thermal gap filler with a conductivity of 2.8 - 3.0 W/mK. Tflex™ SF600 DF is designed for applications which are silicone sensitive. This material is certified to UL 94V0 flammability ratings.
Laird Technologies - Thermal Products' Tflex SF600D Series

Features Applications
  • Silicone-free gap pad
  • 2.8 W/mK thermal conductivity for material thicknesses of 10 to 30 mils
  • 3.0 W/mK thermal conductivity for material thicknesses of 40 to 60 mils
  • Available in thicknesses from 0.010-inch (0.25 mm) through 0.060-inch (1.5 mm) in 0.010-inch increments
  • Differential tack on one side for easy assembly and rework
  • Automotive applications
  • Applications involving optical components
  • Flat panel displays
  • Hard drives

Digi-Key P/N Manufacturer P/N Description
926-1332-ND A16367-02 TFLEX SF620DF 8.5X9" Datasheet
926-1333-ND A16367-04 TFLEX SF640 DF 8.5" X 9.0"
926-1334-ND A16367-06 TFLEX SF660 DF 8.5" X 9.0"