- Excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile package is 40% thinner than
the standard SOD-123.
- Tiny plastic SMD package
- High current capability
- High surge capability
- Lead-free parts meet environmental standards of MIL-STD-19500/228
- Glass passivated chip junction
- Epoxy: UL94-V0 rated flame retardant
- Case: molded plastic, SOD-123H/MINI SMA
- Terminals: solderable per MIL-STD-750,
- Polarity: indicated by cathode band
- Mounting position: any
- Weight: 0.011 grams (approx.)