- Excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile package is 40% thinner than the standard SOD-123.
- Low power loss, high efficiency
- High current capability, low forward voltage drop
- High surge capability
- Guarding for overvoltage protection
- Ultra-high-speed switching
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- Silicon epitaxial planar chip, metal silicon junction
- Lead-free part meets environmental standards of
MIL-STD-19500/228
- Epoxy: UL94-V0 rated flame retardant
- Case: molded plastic, SOD-123H/MINI SMA
- Terminals: solderable per MIL-STD-750,
Method 2026
- Polarity: indicated by cathode band
- Mounting position: any
- Weight: 0.011 grams (approx.)
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