- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- Low power loss, high efficiency.
- High current capability, low forward voltage drop.
- High surge capability.
- Guardring for overvoltage protection.
- Ultra-high-speed switching.
- Silicon epitaxial planar chip, metal silicon junction.
- Lead-free parts meet environmental standards of MIL-STD-19500/228
- Case: molded plastic, SOD-123T/Mini SMA.
- Terminals: solderable per MIL-STD-750, method 2026.
- Polarity: indicated by cathode band.
- Weight: 0.018 grams approx.