zSFP+ Interconnect


TE Connectivity's zSFP+ pluggable I/O interconnect was designed to upgrade SFP/SFP+ connectors

TE Connectivity's zSFP+ pluggable I/O interconnect was designed to quickly and easily upgrade SFP/SFP+ connectors from current 10-16 Gbps speeds to future 28 Gbps speeds. The product is backwards-compatible to SFP+ products in footprint, mating interface, and cage dimensions to allow for easy drop-in replacement within current communication systems.

For newer equipment designs, the zSFP+ interconnect can support either 10 Gbps Ethernet or 16 Fibre Channel Gbps data rates, while accommodating a long-term upgrade path for 28 or potentially 40 Gbps performance. This equates to long-term cost savings as the product eliminates the need to fully redesign or reinstall communication equipment for higher performance.

The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32 G (28.05 Gbps line rate). The entire product family is offered as a dual-source option with Molex Incorporated.

Features
  • Data Rates
    • 28 Gbps up to potentially 40 Gbps
  • Surface-mount connector design
  • Press-fit cages for one-step, easy PCB placement
  • Coupled, narrow-edged, blanked-, and formed-contact geometry and insert molding for superior signal integrity, mechanical, and electrical performance
  • Backwards compatibility: Shares same PCB footprint, mating interface, and cage dimensions with the SFP+ connector
  • EMI containment offered in either elastomeric gasket or spring finger options
  • Single-port high cages (1 x N) for design flexibility/accommodates belly-to-belly applications to increase density while saving PCB space
  • Offers stacked cages in 2 x 1, 2 x 2, 2 x 4, 2 x 6, 2 x 8, 2 x 10, and 2 x 12 port configurations
  • Heat sinks, LEDs, and plating choices offered for various design specifications
  • Mechanical
    • Mating force: 25 N
    • Unmating force: 11.5 N
    • Durability (min.): 250 cycles
  • Electrical
    • Voltage (max.): 120 V max
    • Current (max.): 0.5 A
    • Dielectric withstanding voltage: 300 VAC between contacts
  • Physical
    • High-temperature thermoplastic housing (glass filled, UL 94V-0 black)
    • High-performance copper alloy contacts
    • Nickel underplating, tin plating on solder tail area, and gold plating on mating area
    • Operating temperature: -40°C to 85°C
Applications
  • Telecommunications
    • Cellular infrastructure
    • Access routers and switches
    • Servers
    • Switches
  • Data center
    • Servers
    • Storage
  • Medical
    • Medical diagnostic equipment
  • Networking
    • Network interface
    • Switches
    • Routers
  • Test and measurement equipment

zSFP+ Interconnect

Manufacturer Part Number Description Available Quantity Datasheets
2170088-1 CONN ZSFP+ 20CKT 30U 1100
2170088-2 CONN ZSFP+ 20CKT 15U 1100
2198318-2 ZSFP+ STACKED 2X1 W/4 LP GASKET 252
2198318-6 ZSFP+ STACKED 2X1 W/4 LP SPRING 252
2180324-2 ZSFP+ STACKED 2X4 W/4 LP GASKET 84
2180324-6 ZSFP+ STACKED 2X4 W/4 LP SPRING 84
2198339-2 ZSFP+ STACKED 2X6 W/4 LP GASKET 54
2198339-6 ZSFP+ STACKED 2X6 W/4 LP SPRING 25