Alpha and Omega offers their 8 V, 20 V, and 30 V MOSFETs in ultra-thin molded chip-scale packaging
Alpha and Omega offers low on-resistance 8 V, 20 V, and 30 V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP packaging technology offers AOS's low on-resistance MOSFET silicon in a protective Green (halogen-free) molding compound. The product provides a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products. The MCSP devices offer performance benefits and can easily replace industry-standard CSP devices by offering the same footprint, pin-out, and pitch.