AOC24xx Family


Alpha and Omega offers their 8 V, 20 V, and 30 V MOSFETs in ultra-thin molded chip-scale packaging

Alpha and Omega offers low on-resistance 8 V, 20 V, and 30 V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP packaging technology offers AOS's low on-resistance MOSFET silicon in a protective Green (halogen-free) molding compound. The product provides a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products. The MCSP devices offer performance benefits and can easily replace industry-standard CSP devices by offering the same footprint, pin-out, and pitch.

Features and Benefits
  • Maximum height of 0.3 mm
  • Reduces package height by 50%
  • Improves the overall mechanical robustness of the package
  • N- and P-channel devices with VDS ratings from 8 V to 30 V
  • Packaging in 0.97 mm x 0.97 mm and 1.57 mm x 1.57 mm
  • Ultra-low on-resistance rated at 1.2 VGS
Applications
  • Smart-phones
  • Tablet PCs
  • Ultrabooks
  • Other mobile hand-held devices

AOC24xx Family

Manufacturer Part Number Description Available Quantity Datasheets
AOC2403 MOSFET P-CH 20V 1.8A 4WLCSP 4280