30 V PowerPAIR® 3 x 3 MOSFET


Vishay's PowerPAIR® 3 x 3 MOSFET increases power density while running 30% cooler

Vishay Siliconix announces a new 30 V, asymmetric, dual TrenchFET power MOSFET in the PowerPAIR® 3 mm by 3 mm package utilizing TrenchFET Gen IV technology. Providing 57% lower on-resistance, up to 25% higher power density, and 5% higher efficiency than previous-generation devices in this package size, the Vishay Siliconix SiZ340DT helps to reduce power loss, save space, and simplify the design of highly-efficient synchronous buck converters by combining a high- and low-side MOSFET in one compact package. The TrenchFET Gen IV technology of the SiZ340DT utilizes an advanced high-density design to reduce on-resistance and to optimize gate charges. Reducing power loss significantly, the SiZ340DT demonstrates better efficiency than competitors, particularly for output currents of 10 A and higher. With this higher efficiency, the SiZ340DT can run 30% cooler than previous-generation devices at the same output load, or provide increased power density. For typical DC/DC topologies with 10 A to 15 A output current and an output voltage below 2 V, the compact 3 mm by 3 mm footprint area of the SiZ340DT potentially saves up to 77% PCB space compared to using discrete solutions, such as a PowerPAK® 1212-8 MOSFET for the high- and a PowerPAK SO-8 for the low side. Reducing switching losses, the device allows higher switching frequencies beyond 450 kHz to shrink the PCB size, by enabling smaller inductors and capacitors.

Features Applications
  • Both high- and low-side MOSFETs in one compact PowerPAIR 3 mm by 3 mm package
  • Saves space over using discrete solutions, reduces component count, and simplifies designs
  • TrenchFET Gen IV technology enables on-resistance down to 5.1 mΩ at 10 V for the low-side MOSFET and 9.5 mΩ at 10 V for the high side
  • Increases efficiency and output capability from previous generation
  • Low on-resistance times gate-charge FOM reduces conduction and switching losses to improve efficiency
  • Enables cooler operation or higher power density
  • Achieves high efficiency under high switching frequencies > 450 kHz
  • Enables smaller inductors and capacitors to reduce the PCB size
  • 100 % Rg and UIS tested
  • Halogen-free according to the JEDEC JS709A definition
  • Compliant to RoHS Directive 2011/65/EU
  • Synchronous buck designs in “cloud computing” infrastructures, servers, telecommunication equipment, and various client-side electronic devices and mobile computing
  • DC/DC blocks including system auxiliary power rails in servers, computers, notebook computers, graphic cards, gaming consoles, storage arrays, telecom equipment, DC/DC bricks, and POL
  • DC/DC conversion circuitry that supplies power to FPGAs

30 V TrenchFET Gen IV MOSFET and PowerPAIR

PowerPAIR® 3x3 MOSFET

Manufacturer Part Number Description Available Quantity Datasheets
SIZ340DT-T1-GE3 MOSFET 2N-CH 30V 30A SOT-23 2890