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- Established in 1957, Wakefield Engineering designs efficient, affordable and reliable thermal management solutions for a diverse range of commercial, industrial, and military markets. Recognized as a worldwide leader, Wakefield Engineering has grown with the market while expanding into others, responding to technological advances and anticipating industry demands. Wakefield Engineering is a wholly owned subsidiary of Alpha Technologies Group, Inc.
Liquid Cold Plates
Wakefield's liquid cooling is a natural evolution beyond air cooling where either due to thermal or footprint requirements, the desired performance can no longer be economically met by air cooling. Learn More
omniKlip-Series Heat Sinks and Clips
The Wakefield-Vette omniKlip heat sink series is a configurable and patented (pat. pending), high-performance, low-cost and compact solution for TO-220, TO-247, and TO-264 or similar packages.
High-Performance Board-Level Heat Sinks
Innovation in SMT-compatible heatsinks from Wakefield-Vette are designed to meet the needs of newer, higher-power, SMT semiconductors.
Thermal Extrusions for High-Power Semiconductors
Extruded heat sinks from Wakefield are manufactured by pushing hot aluminum billets through a steel die to produce the final shape.
The Ripac ECO from Wakefield is low cost alternative for fast and easy handling. This subrack system is used for standard applications and is suitable for installation of standardized PCBs or plug-in units of 160 and 220 mm depths.
Ripac Easy Components
Wakefield-Vette's Ripac easy accessories. The modular concept of Ripac subracks facilitates a wide range of application options with a minimum of components.
Ripac Vario Subrack System
The Ripac Vario Subrack system from Wakefield is used for standard applications or complex installations. This systems is suitable for installation of standardized PCBs or plug-in units up to 400 mm in depth.
Intro to the EPS Heitec Sub-rack System
Duration: 5 minutes
Overview of the EPS Heitec Sub-rack enclosure series.
Liquid Cold Plate Technologies
Liquid cold plate cooling from Wakefield is a natural evolution beyond air cooling where the desired performance can no longer be economically met by air cooling.
Chip Clip Heat Sinks
This presentation will provide an overview of the 901-910 Series of Chip Clip Heat Sinks from Wakefield-Vette.
Intro to Wedgelocks
Wedgelock card retainers offer one of the highest locking forces available for cold wall applications.
Heat Pipe Overview: Wakefield-Vette
Fluid Phase Change applications, often referred to as “re-circulating,” use closed loop heat pipes to transfer heat quickly through evaporation and condensation within the heat pipe.
Wakefield Solutions Aluminum Extrusion Press
Since its days as National Northeast, Wakefield Solutions has been one of the leading aluminum extruders and secondary machining since 1953! With two extrusions presses and over 110 Machining Centers!
Wakefield-Vette Minute: Conduction Cooled Heat Frames
Wakefield-Vette's Raleigh, North Carolina facility has extensive experience manufacturing milled aluminum heat frames. Heat Frames are used to meet or exceed rugged specification requirements.
Bonded Fin Heat Sinks: Wakefield-Vette
Bonded fins are a good high power solution for either natural or forced convection. Individual straight fins are cut and bonded into a grooved base plate.
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