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- Established in 1957, Wakefield Engineering designs efficient, affordable and reliable thermal management solutions for a diverse range of commercial, industrial, and military markets. Recognized as a worldwide leader, Wakefield Engineering has grown with the market while expanding into others, responding to technological advances and anticipating industry demands. Wakefield Engineering is a wholly owned subsidiary of Alpha Technologies Group, Inc.

Featured Products

Image of Wakefield's Liquid Cold Plates 180 Series

Liquid Cold Plates

Wakefield's liquid cooling is a natural evolution beyond air cooling where either due to thermal or footprint requirements, the desired performance can no longer be economically met by air cooling. Learn More

Image of Wakefield-Vette's Individual Heat Pipes

Individual Heat Pipes

Wakefield-Vette's grooved, mesh, powder, and hybrid heat pipes move heat from the source to an area where the heat can be dissipated. Learn More

Newest Products View All (16)

Image of Wakefield-Vette's ulTIMiFlux Dielectric Phase Change Thermal Material

ulTIMiFlux™ Dielectric Phase-Change Thermal Material

Wakefield-Vette's ulTIMiFlux high performance dielectric phase-change material which utilizes a substrate to act as a thermally conductive carrier in order to deliver you uniform thickness coating of phase-change compound on both sides.

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Image of Wakefield-Vette's ulTIMiFlux Thermal Interface Material

ulTIMiFlux Thermal Interface Material

Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability, and custom sizes for your thermal system needs.

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Image of Wakefield omniKlip-Series Heat Sinks and Clips

omniKlip-Series Heat Sinks and Clips

The Wakefield-Vette omniKlip heat sink series is a configurable and patented (pat. pending), high-performance, low-cost and compact solution for TO-220, TO-247, and TO-264 or similar packages.

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Image of Wakefield High-Performance Board-Level Heat Sinks

High-Performance Board-Level Heat Sinks

Innovation in SMT-compatible heatsinks from Wakefield-Vette are designed to meet the needs of newer, higher-power, SMT semiconductors.

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Image of Wakefield's Thermal Extrusions

Thermal Extrusions for High-Power Semiconductors

Extruded heat sinks from Wakefield are manufactured by pushing hot aluminum billets through a steel die to produce the final shape.

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Image of Wakefield's Ripac Easy

Ripac Easy Components

Wakefield-Vette's Ripac easy accessories. The modular concept of Ripac subracks facilitates a wide range of application options with a minimum of components.

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Product Training Modules View All (5)

Heat Pipe - SM

Heat Pipe Overview

Duration: 5 minutes

This presentation will discuss the what is a heat pipe, the types of heat pipes, and heat pipe assemblies.

Ripac ECO

Intro to the EPS Heitec Sub-rack System

Duration: 5 minutes

Overview of the EPS Heitec Sub-rack enclosure series.

Liquid Cold Plate Technology

Liquid Cold Plate Technologies

Duration: 5 minutes

Liquid cold plate cooling from Wakefield is a natural evolution beyond air cooling where the desired performance can no longer be economically met by air cooling.

WKV Heat Sink

Chip Clip Heat Sinks

Duration: 5 minutes

This presentation will provide an overview of the 901-910 Series of Chip Clip Heat Sinks from Wakefield-Vette.

Featured Videos View All (14)

Wakefield-Vette Minute: Front Panels

Wakefield-Vette manufactures custom front panels that are silk-screened, fully assembled, and ready to mount to your Printed Circut Board. Front Panels are made from aluminum extrusions and are manufactured on high-speed CNC machines.

Bonded Fin Heat Sinks: Wakefield-Vette

Bonded fins are a good high power solution for either natural or forced convection. Individual straight fins are cut and bonded into a grooved base plate.

Aluminum Extrusion Press, Watch Wakefield Solutions Aluminum Being Extruded

After the aluminum billet is heated it is then pushed through a die in which shape of the extrusion is intended for.

Heat Pipe Overview: Wakefield-Vette

Fluid Phase Change applications, often referred to as “re-circulating,” use closed loop heat pipes to transfer heat quickly through evaporation and condensation within the heat pipe.

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