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- Powerex turns ideas into cost-effective products and is a leading supplier of discrete, modular and integrated high power semiconductor solutions, supporting many markets, including: AC and DC Motor Controls, Aircraft, Alternative Energy (WIND, Photovoltaic), Communications, Electrical, Industrial Heating, Medical Power Supplies, Transportation, UPS, Vehicles, and Welding.
Powerex Version 6 DIPIPM™ and 6.1 Generation NX Series IGBTs
Powerex's version 6 DIPIPM™ and 6.1 generation NX series IGBTs simplify the design of low- and medium-power inverters for various applications.
Powerex DIPIPMs are Intelligent Power Modules that integrate power devices, drivers, and protection circuitry.
6th Generation S-Series IGBTs
Powerex's 6th generation S-Series IGBTs are improved versions of the earlier 5th generation A-Series and NF-Series IGBTs in compatible packages.
Powerex CD4 and CD6 POW-R-BLOK™ VERSION C
Powerex's CD4 and CD6 POW-R-BLOK™ VERSION C modules are designed for use in applications requiring rectification, half-control, or full control.
Powerex's ND POW-R-BLOK™ and NS POW-R-BLOK™ are designed for use in applications requiring phase control and isolated packaging.
Version 6 DIPIM™
Duration: 5 minutes
Designed to provide a compact and reliable interface between microcontroller logic and the inverted output power.
NX-Series of IGBTs Overview
The 1200 and 1700 volt NX series modules offer low loss, state-of-the-art silicon, Low Rth due to AIN ceramic substrate, and improved performance.
Key Features and Advantages for Using POW-R-BLOK™ Modules
This video shows key features and advantages for using Powerex POW-R-BLOK™ Modules.
Powerex Module Processing at New Medium Volume Semiconductor Module Assembly Facility
Tour of the new module assembly facility of Powerex in Yongstown, PA
Silicon Carbide Technology
Overview of Silicon Carbide Technology
Benefits of Mega Power Dual Technology
Mega Power Dual™, a new optimized IGBT power package from Powerex, offers the benefits of three new technologies in one compact package.
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