WINC1500-MR210PA DATASHEET
IEEE 802.11 b/g/n IoT Module
Datasheet
Description
The ATWINC1500-MR210PA is a low-power consumption 802.11 b/g/n IoT
(Internet of Things) module which is specifically optimized for low power IoT
applications. The highly integrated module features small form factor (21.5mm x
14.5mm x3.4mm) while fully integrating Power Amplifier, LNA, Switch, Power
Management, and PCB antenna. With seamless roaming capabilities and
advanced security, it could be interoperable with various vendors' 802.11b/g/n
Access Points in wireless LAN. The module provides SPI and UART to interface to
host controller.
Features
IEEE
®
802.11 b/g/n 20MHz (1x1) solution
Single spatial stream in 2.4GHz ISM band
Integrated PA and T/R Switch
Integrated PCB antenna
Superior Sensitivity and Range via advanced PHY signal processing
Advanced Equalization and Channel Estimation
Advanced Carrier and Timing Synchronization
Wi-Fi Direct and Soft-AP support
Supports IEEE 802.11 WEP, WPA, WPA2 Security
Supports China WAPI security
Superior MAC throughput via hardware accelerated two-level
A-MSDU/A-MPDU frame aggregation and block acknowledgement
On-chip memory management engine to reduce host load
SPI, UART, and I
2
C host interfaces
2- or 3-wire Bluetooth
®
coexistence interface
Operating temperature range of -40°C to +85°C
I/O operating voltage of 2.7V to 3.6V
Integrated Flash memory for system software
Power Save Modes
4μA Deep Power Down mode typical @3.3V I/O
850μA Doze mode (Chip settings are preserved. Used for beacon monitoring
mode)
1
1
See
Power Consumption
for module power modes.
Atmel-42376C-ATWINC1500-MR210PA-SmartConnect-Datasheet_032015
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On-chip low power sleep oscillator
Fast host wake-up from Doze mode by a pin or SPI transaction
Fast Boot Options
On-Chip Boot ROM (Firmware instant boot)
SPI flash boot (firmware patches and state variables)
Low-leakage on-chip memory for state variables
Fast AP Re-Association (150ms)
On-Chip Network Stack to offload MCU
Integrated Network IP stack to minimize host CPU requirements
Network features TCP, UDP, DHCP, ARP, HTTP, SSL, and DNS
Small footprint host driver (4KB flash – less than 1KB RAM)
ATWINC1500-MR210P [DATASHEET]
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Table of Contents
1
Ordering Information and Module Marking
................................................................
5
2
Block Diagram
.............................................................................................................
6
3
Pinout Information
.......................................................................................................
7
3.1
Pin Description
......................................................................................................................................
7
3.2
Module Outline Drawing
........................................................................................................................
9
4
Electrical Specifications
.............................................................................................
9
4.1
Absolute Ratings
...................................................................................................................................
9
4.2
Recommended Operating Conditions
.................................................................................................
10
5
CPU and Memory Subsystems
.................................................................................
10
5.1
Processor
............................................................................................................................................
10
5.2
Memory Subsystem
.............................................................................................................................
10
5.3
Non-Volatile Memory (eFuse)
.............................................................................................................
10
6
WLAN Subsystem
......................................................................................................
11
6.1
MAC
..............................................................................................................................................
11
6.1.1
Features
.................................................................................................................................
11
6.1.2
Description
..............................................................................................................................
12
6.2
PHY
..............................................................................................................................................
12
6.2.1
Features
.................................................................................................................................
12
6.2.2
Description
..............................................................................................................................
12
6.3
Radio
..............................................................................................................................................
13
7
External Interfaces
....................................................................................................
14
7.1
SPI Interface
.......................................................................................................................................
14
7.1.1
Overview
.................................................................................................................................
14
7.1.2
SPI Timing
..............................................................................................................................
15
7.2
UART Interface
...................................................................................................................................
16
7.3
Wi-Fi/Bluetooth Coexistence
...............................................................................................................
16
8
Power Consumption
..................................................................................................
17
8.1
Description of Device States
...............................................................................................................
17
8.2
Controlling the Device States
..............................................................................................................
17
8.3
Restrictions for Power States
..............................................................................................................
17
8.4
Power-Up/Down Sequence
.................................................................................................................
17
8.5
Digital I/O Pin Behavior during Power-Up Sequences
.........................................................................
18
9
VDDIO Load Switch
...................................................................................................
19
10
Notes On Interfacing to the ATWINC1500-MR210P
.................................................
20
10.1
Programmable Pull Up Resistors
........................................................................................................
20
11
Recommended Footprint (Unit: mm)
........................................................................
21
12
RF Performance Placement Guidelines
...................................................................
21
13
Recommended Reflow Profile
..................................................................................
22
14
Module Schematic
.....................................................................................................
23
ATWINC1500-MR210P [DATASHEET]
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15
Module Bill of Materials (BOM)
.................................................................................
24
16
Application Schematic
..............................................................................................
25
17
Reference Documentation and Support
...................................................................
26
17.1
Reference Documents
.........................................................................................................................
26
18
Revision History
........................................................................................................
27
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1
Ordering Information and Module Marking
Table 1-1.
Ordering Details
Ordering Code
Package
Description
ATWINC1500-MR210PA
22x15mm
Certified module with ATWINC1500A chip and PCB antenna
Figure 1-1.
Marking Information
ATWINC1500-MR210P [DATASHEET]
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2
Block Diagram
Figure 2-1.
Block Diagram of the Module
ATWINC1500A
802.11 B,G,N SOC
BALUN
26 Mhz Crystal
RX/TX
Printed 2.4GHz
Antenna
VBAT
1.3V
I2C
SPI_CFG
GPIO15
GPIO16
GPIO18
IRQN
Chip_EN
WAKE
RESET
GND
SPI
Load
Switch
VDDIO
Chip_EN
VDDIO
Switching
Regulator
Chip_EN
VBAT
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3
Pinout Information
3.1
Pin Description
Figure 3-1.
Pin Assignment
Table 3-1.
Pin Description
NO
Name
Type
Description
Programmable
Pull-up Resistor
1
GPIO_18
I/O
General purpose I/O.
Yes
2
I2C_SCL
I/O
I
2
C Slave Clock. Currently used only for Atmel debug. Not for
customer use. Leave unconnected.
Yes
3
I2C_SDA
I/O
I
2
C Slave Data. Currently used only for Atmel debug. Not for cus-
tomer use. Leave unconnected.
Yes
4
RESET_N
I
Active-Low Hard Reset. When asserted to a low level, the module
will be placed in a reset state. When asserted to a high level, the
module will run normally. Connect to a host output that defaults
low at power up. If the host output is tri-stated, add a 1M
Ω
pull-down resistor to ensure a low level at power up.
No
5
NC
-
No connect
6
NC
-
No connect
7
NC
-
No connect
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NO
Name
Type
Description
Programmable
Pull-up Resistor
8
NC
-
No connect
9
GND_1
-
GND
10
SPI_CFG
I
Tie to VDDIO through a 1M
Ω
resistor to enable the SPI interface.
No
11
WAKE
I
Host Wake control. Can be used to wake up the module from Doze
mode. Connect to a host GPIO.
Yes
12
GND_2
-
GND
13
IRQN
O
ATWINC1500-MR210PA Device Interrupt output. Connect to host
interrupt input pin.
Yes
14
UART_TXD
O
UART Transmit Output from ATWINC1500-MR210P.
Yes
15
SPI_RXD
I
SPI MOSI (Master Out Slave In) pin.
Yes
16
SPI_SSN
I
SPI Slave Select. Active low.
Yes
17
SPI_TXD
O
SPI MISO (Master In Slave Out) pin.
Yes
18
SPI_SCK
I
SPI Clock.
Yes
19
UART_RXD
I
UART Receive input to ATWINC1500-MR210P.
Yes
20
VBATT
-
Battery power supply.
21
GPIO_1
I
General Purpose I/O.
Yes
22
CHIP_EN
I
Module enable. High level enables module, low level places mod-
ule in Power Down mode. Connect to a host Output that defaults
low at power up. If the host output is tri-stated, add a 1M
Ω
pull-down resistor to ensure a low level at power up.
No
23
VDDIO
-
I/O Power Supply. Must match host I/O voltage.
24
1P3V_TP
-
1.3V VDD Core Test Point. Leave unconnected.
25
NC
-
No connect
26
GPIO_15
I/O
General purpose I/O.
Yes
27
GPIO_16
I/O
General purpose I/O.
Yes
28
GND_3
-
GND
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3.2
Module Outline Drawing
Figure 3-2.
Module Drawings – Top and Bottom Views (unit = mm)
4
Electrical Specifications
4.1
Absolute Ratings
Table 4-1.
Voltages
Symbol
Description
Min.
Max.
Unit
VBAT
Input supply Voltage
-0.3
5.0
V
VDDIO
I/O Voltage
-0.3
4.6
V
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4.2
Recommended Operating Conditions
Table 4-2.
Recommended Operating Conditions
Test conditions: -40°C - +85°C
Symbol
Min.
Typ.
Max.
Unit
VBAT
3.0
3.6
4.2
V
VDDIO
2.7
3.3
3.6
V
5
CPU and Memory Subsystems
5.1
Processor
ATWINC1500A has a Cortus APS3 32-bit processor. This processor performs many of the MAC functions,
including but not limited to association, authentication, power management, security key management, and
MSDU aggregation/de-aggregation. In addition, the processor provides flexibility for various modes of operation,
such as STA and AP modes.
5.2
Memory Subsystem
The APS3 core uses a 128KB instruction/boot ROM along with a 128KB instruction RAM and a 64KB data RAM.
ATWINC1500A also has 4Mb of flash memory, which can be used for system software. In addition, the device
uses a 128KB shared RAM, accessible by the processor and MAC, which allows the APS3 core to perform
various data management tasks on the TX and RX data packets.
5.3
Non-Volatile Memory (eFuse)
ATWINC1500A has 768 bits of non-volatile eFuse memory that can be read by the CPU after device reset. This
non-volatile one-time-programmable (OTP) memory can be used to store customer-specific parameters, such as
MAC address; various calibration information, such as TX power, crystal frequency offset, etc.; and other
software-specific configuration parameters. The eFuse is partitioned into six 128-bit banks. Each bank has the
same bit map, which is shown in
Figure 5-1
. The purpose of the first 80 bits in each bank is fixed, and the
remaining 48 bits are general-purpose software dependent bits, or reserved for future use. Since each bank can
be programmed independently, this allows for several updates of the device parameters following the initial
programming, e.g. updating MAC address. Refer to ATWINC1500A Programming Guide for the eFuse
programming instructions.
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Figure 5-1.
eFuse Bit Map
Bank 0
Bank 1
Bank 2
Bank 3
Bank 4
Bank 5
F
MAC ADDR
Used
Invalid
Version
Reserved
MAC ADDR
Used
FO
Flags
G
3
1
1
4
1
Used
TX
Gain
Correc
tion
Used
Freq.
Offset
1
7
48
8
8
16
1
15
128 Bits
6
WLAN Subsystem
The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY). The
following two subsections describe the MAC and PHY in detail.
6.1
MAC
6.1.1
Features
The ATWINC1500A IEEE802.11 MAC supports the following functions:
IEEE 802.11b/g/n
IEEE 802.11e WMM QoS EDCA/PCF multiple access categories traffic scheduling
Advanced IEEE 802.11n features:
Transmission and reception of aggregated MPDUs (A-MPDU)
Transmission and reception of aggregated MSDUs (A-MSDU)
Immediate Block Acknowledgement
Reduced Interframe Spacing (RIFS)
Support for IEEE802.11i and WFA security with key management
WEP 64/128
WPA-TKIP
128-bit WPA2 CCMP (AES)
Support for WAPI security
Advanced power management
Standard 802.11 Power Save Mode
Wi-Fi Alliance WMM-PS (U-APSD)
RTS-CTS and CTS-self support
Supports either STA or AP mode in the infrastructure basic service set mode
Supports independent basic service set (IBSS)
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6.1.2
Description
The ATWINC1500A MAC is designed to operate at low power while providing high data throughput. The IEEE
802.11 MAC functions are implemented with a combination of dedicated datapath engines, hardwired control
logic, and a low-power, high-efficiency microprocessor. The combination of dedicated logic with a programmable
processor provides optimal power efficiency and real-time response while providing the flexibility to
accommodate evolving standards and future feature enhancements.
Dedicated datapath engines are used to implement data path functions with heavy computational. For example,
an FCS engine checks the CRC of the transmitting and receiving packets, and a cipher engine performs all the
required encryption and decryption operations for the WEP, WPA-TKIP, WPA2 CCMP-AES, and WAPI security
requirements.
Control functions which have real-time requirements are implemented using hardwired control logic modules.
These logic modules offer real-time response while maintaining configurability via the processor. Examples of
hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX
control, interframe spacing, etc.), protocol timer module (responsible for the Network Access Vector, back-off
timing, timing synchronization function, and slot management), MPDU handling module,
aggregation/de-aggregation module, block ACK controller (implements the protocol requirements for burst block
communication), and TX/RX control FSMs (coordinate data movement between PHY-MAC interface, cipher
engine, and the DMA interface to the TX/RX FIFOs).
The MAC functions implemented solely in software on the microprocessor have the following characteristics:
Functions with high memory requirements or complex data structures. Examples are association table
management and power save queuing.
Functions with low computational load or without critical real-time requirements. Examples are
authentication and association.
Functions which need flexibility and upgradeability. Examples are beacon frame processing and QoS
scheduling.
6.2
PHY
6.2.1
Features
The ATWINC1500A IEEE802.11 PHY supports the following functions:
Single antenna 1x1 stream in 20MHz channels
Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, 11Mbps
Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, 54Mbps
Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2, 13.0,
14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, 72.2Mbps
IEEE 802.11n mixed mode operation
Per packet TX power control
Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery, and
frame detection
6.2.2
Description
The ATWINC1500A WLAN PHY is designed to achieve reliable and power-efficient physical layer
communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced
algorithms have been employed to achieve maximum throughput in a real world communication environment
with impairments and interference. The PHY implements all the required functions such as FFT, filtering, FEC
(Viterbi decoder), frequency and timing acquisition and tracking, channel estimation and equalization, carrier
sensing and clear channel assessment, as well as the automatic gain control.
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6.3
Radio
Table 6-1.
Radio Performance under Typical Conditions: VBAT=3.3V; VDDIO=3.3V; Temp: 25°C @ RF Pins
Feature
Description
Module Part Number
ATWINC1500-MR210P
WLAN Standard
IEEE 802.11b/g/n, Wi-Fi compliant
Host Interface
SPI, UART
Dimension
L x W x H: 21.72 x 14.73 x 3.5 (typical) mm
Frequency Range
2.412GHz ~ 2.4835GHz (2.4GHz ISM Band)
Number of Channels
11 for North America, 13 for Europe, and 14 for Japan
Modulation
802.11b : DQPSK, DBPSK, CCK
802.11g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK
Output Power
1
802.11b /11Mbps : 19dBm ± 1dB
802.11g /54Mbps : 15.5dBm ± 1dB @ EVM -28dB
802.11n /65Mbps : 13dBm ± 1dB @ EVM -30dB
Receive Sensitivity
(11n,20MHz)
@10% PER
- MCS=0
PER @ -90dBm ± 1dB
- MCS=1
PER @ -86dBm ± 1dB
- MCS=2
PER @ -84dBm ± 1dB
- MCS=3
PER @ -81.5dBm ± 1dB
- MCS=4
PER @ -78dBm ± 1dB
- MCS=5
PER @ -74dBm ± 1dB
- MCS=6
PER @ -72.5dBm ± 1dB
- MCS=7
PER @ -71.5dBm ± 1dB
Receive Sensitivity (11g)
@10% PER
- 6Mbps
PER @ -91dBm ± 1dB
- 9Mbps
PER @ -89dBm ± 1dB
- 12Mbps
PER @ -88.5dBm ± 1dB
- 18Mbps
PER @ -86.5dBm ± 1dB
- 24Mbps
PER @ -84dBm ± 1dB
- 36Mbps
PER @ -78.5dBm ± 1dB
- 48Mbps
PER @ -77dBm ± 1dB
- 54Mbps
PER @ -75dBm ± 1dB
Receive Sensitivity (11b)
- 1Mbps
PER @ -98dBm ± 1dB
- 2Mbps
PER @ -95dBm ± 1dB
- 5.5Mbps
PER @ -93dBm ± 1dB
@8% PER
- 11Mbps
PER @ -89dBm ± 1dB
Data Rate
802.11b : 1, 2, 5.5, 11Mbps
802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps
ATWINC1500-MR210P [DATASHEET]
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Feature
Description
Data Rate
(20MHz ,normal GI,800ns)
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
Data Rate
(20MHz ,short GI,400ns)
802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps
Maximum Input Level
802.11b : 0dBm typical
802.11g/n : -5dBm typical
Operating temperature
2
-40°C to 85°C
Storage temperature
-40°C to 85°C
Humidity
Operating Humidity 10% to 95% Non-Condensing
Storage Humidity 5% to 95% Non-Condensing
Notes:
1.
Measured at 802.11 spec compliant EVM/Spectral Mask.
2.
RF performance guaranteed for Temp range -30 to 85deg. 1dB derating in performance at -40deg.
7
External Interfaces
7.1
SPI Interface
7.1.1
Overview
ATWINC1500-MR210PA has a Serial Peripheral Interface (SPI) that operates as a SPI slave. The SPI interface
can be used for control and for serial I/O of 802.11 data. The SPI pins are mapped as shown in
Table 7-1
. The
SPI is a full-duplex slave-synchronous serial interface that is available immediately following reset when pin 10
(SPI_CFG) is tied to VDDIO.
Table 7-1.
SPI Interface Pin Mapping
Pin #
SPI Function
10
CFG: Must be tied to VDDIO
16
SSN: Active Low Slave Select
15
MOSI(RXD): Serial Data Receive
18
SCK: Serial Clock
17
MISO(TXD): Serial Data Transmit
When the SPI is not selected, i.e., when SSN is high, the SPI interface will not interfere with data transfers
between the serial-master and other serial-slave devices. When the serial slave is not selected, its transmitted
data output is buffered, resulting in a high impedance drive onto the MISO line.
The SPI interface responds to a protocol that allows an external host to read or write any register in the chip as
well as initiate DMA transfers.
The SPI SSN, MOSI, MISO, and SCK pins of the ATWINC1500-MR210PA have internal programmable pull-up
resistors (See Section
10.1
). These resistors should be programmed to be disabled. Otherwise, if any of the SPI
pins are driven to a low level while the ATWINC1500-MR210PA is in the low power sleep state, current will flow
from the VDDIO supply through the pull-up resistors, increasing the current consumption of the module.