Texas Instruments' 6 A, 14.5 V TPS84620 achieves a power density of greater than 800 W/in3 with up to 95% efficiency and 30% better thermal dissipation than competitors do. This integrated step-down solution combines the inductor and passives onto one device and requires only three external components, resulting in a complete solution in a space less than 200 mm2. The TPS84620 supports a variety of high-power telecom infrastructure and industrial systems that use DSPs and FPGAs.
The TPS84620RUQ is an easy-to-use integrated power solution that combines a 6A DC/DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 9x15x2.8mm BQFN package is easy to solder onto a PCB and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6A rated output current at 85°C ambient temperature without airflow.
The TPS84620 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. The advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
- Complete integrated power solution allows small footprint, low-profile design
- Efficiencies up to 96%
- Wide-output voltage adjust 1.2 V to 5.5 V, with 1% reference accuracy
- Optional split power rail allows input voltage down to 1.7 V
- Adjustable switching frequency (480 kHz to 780 kHz)
- Synchronizes to an external clock
- Adjustable slow-start
- Output voltage sequencing / tracking
- Power good output
- Programmable undervoltage lockout (UVLO)
- Output overcurrent protection
- Overtemperature protection
- Pre-bias output startup
- Operating temperature range: -40°C to 85°C
- Enhanced thermal performance: 13°C/W
- Meets EN55022 class B emissions
- Broadband infrastructure
- Communications infrastructure
- Automated test equipment
- Medical equipment
- Compact PCI / PCI Express / PXI Express
- DSP and FPGA point of load applications
- High density distributed power systems