TE Connectivity Impact™ High Density Backplane Connectors
The impact backplane connector system from TE Connectivity AMP Connectors is designed for increased speed and density to meet the future system upgrades and next generation requirements of data networking and telecommunications equipment. This connector system also offers customers a value-added approach of speed, density, cost, and long-term reliability.
The Impact connector design system contains a unique broad-edge coupled design that utilizes low impedance and a localized ground return path in an optimized differential pair array. Additionally, differential pairs are tightly coupled and surrounded by ground structures to isolate the pairs, which in turn reduces crosstalk and increases overall bandwidth performance with minimal performance variance.
Backplane header construction on the Impact connector offers air pockets selectively placed in the header floor to isolate signal pairs. The header signal pins are straight with no forms or offsets, which increase the mechanical strength of the pins. The mating interface features a bifurcated beam with two points of contact with the second staggered 1 mm behind the first for maximum reliability.
The Impact connector offers two different hole sizes and tail lengths with the smaller one providing optimal electrical performance. The larger hole size is ideal for backplane applications that have a slightly larger plate through hole and pin length for manufacturing ability of the printed circuit board.
- Built in guidance available for improved mating alignment and to maximizing available PCB real estate
- Robust daughtercard connector design to withstand connector insertion forces into PCB
- 100Ω impedance
- 25Gb/s performance
The Impact connector system is ideal for high speed, backplane applications including:
- Servers/Blade Servers
||CONN HEADER IMPACT 3PR 10COLUMN
||CONN RCPT IMPACT 3 PAIR 10COLUMN
Impact is a trademark of Molex Incorporated.