Molex's EdgeLine® portfolio encompasses a dynamic group of product families that take advantage of the compact and clean interface of plated fingers on the edge of a printed circuit board. These one-piece solutions are cost effective in that they are only required when a peripheral interface or upgrade card is populated, and have a customizable card-edge interface where designers can specify first-mate, last-break designations, as well as shorter stubs for high-speed communications. The EdgeLine family delivers a low-cost, flexible, and scalable solution for low-to-mid range telecom, computing and storage applications.
EdgeLine vertical connectors are one-piece, press-fit, low-cost connectors with integrated ground blades to support 12.5 Gbps high-speed signal transmissions, circuit size ranges from 20 to 294 contacts and the ability to accommodate 1.57 or 2.36 mm board thicknesses. EdgeLine CoPlanar connectors have individually-grounded, insert-molded wafers for optimized 25 Gbps high-speed signals and the capability to optimize slower-speed single-ended and power circuits with a press-fit, coplanar mount to the motherboard. This family offers integrated power up to 50.0 A and accommodates 1.57 mm or 2.36 mm board thicknesses.
Video - Edgeline® High-Speed Edge Card Connectors
- High-speed differential contact design
- Multiple PCB thicknesses (1.57 mm to 3.18 mm)
- Press-fit, compliant-pin terminal design
- Cost-effective stitched terminal
- Common or singulated ground
- Computing systems