Mill-Max series 162’s SPDIP (shrink plastic) packaging reduces device lead spacing between pins to 1.778 mm (.070") pitch. This technology can be utilized in memory, microcontrollers, video controllers and automotive design applications. SPDIP headers have male pins on both sides and support multiple interconnect applications including: board-to-board stacking, socket testing, and elevating circuits above surrounding components off the PCB surface for easy access (e.g. test points). Mill-Max SPDIP headers are precision-machined using brass alloy 360 and are configured with pluggable tails. They easily mate to their corresponding Mill-Max series 117 SPDIP sockets.