Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.
IEEE 1386 is the industry standard for adding general functionality to motherboards and these mezzanine connectors are the perfect solution for connecting the common mezzanine card (CMC). Some of the environments where this standard can be found are on VME, VME64 and VME64X boards, CompactPCI boards, Multibus I & II boards, desktop and portable computers and servers. They can also be used as modular connectors for front panel and backplane I/O cards.
The 891-10-064-30-120000 male and 893-43-064-30-420000 female are surface mount connectors that have a mated height of 10 mm. The 1 mm pitch provides high density packaging crucial for saving board real estate. Locating posts are incorporated into the housing to promote accurate placement on the P.C.B.
The connectors are RoHS compliant and suitable for "lead free" reflow soldering processes. Packaging is tape and reel, per EIA-783 (56 mm wide; 16 mm pitch).
Both the 891 and 893 connectors feature 30 µ" gold plated contacts, providing optimum conductivity and effective wear resistance, and tin plated solder terminals for ease of soldering. The insulator housings are made of high temperature glass filled LCP, rated UL 94 V-0.
- 64 position mezzanine connectors for board stacking
- 1 mm centerline high density packaging
- Mated connector board stacking height of 10 mm
- Conforms to EIA-700 AAAB for IEEE 1386 applications
- Suitable for "lead free" reflow soldering (260° C peak)
- Tape & Reel packaged per EIA-783 (56 mm wide; 16 mm pitch)