The high density D-Sub range is part of Amphenol FCI's I/O connections portfolio that provides customers access to a wide range of industry standard and application specific I/O interconnect solutions. Amphenol FCI's I/O connector solutions complete board and system designs by providing high density, high-speed interfaces to enable interconnect technologies for networking, storage and memory, and complementary products for power distribution. The range of standardized I/O solutions enables full compliance to industry standards such as Ethernet, SFF, infiniband, USB, PCMCIA or HDMI. With Amphenol FCI's high-speed, power, assembly, and mechanical packaging expertise, a designer gains the advantage of getting his signals out of the box at optimal cost and performance.
Features and Benefits
- Compact-D is the answer to the increasing need for higher density packaging
- Available with different PCB mounting and panel mounting accessory options
- Selected layouts available in press fit and pin-in-paste versions
- Contact layout: 15, 26, 44, 62, or 78 positions
D-Subminiature Connectors High Density