Thermal interface tapes, pads, and epoxies by 3M provide high thermal conductivity by focusing on the two areas that matter most: bulk conductivity and interface conductivity. They address a crucial problem with today's low-power electronic devices – the need to dissipate the sizable amounts of heat being generated.
The thermally conductive adhesive transfer tapes provide efficient thermal transfer for a wide range of applications including bonding heat sinks, heat spreaders, IC packages, power transistors, and more. These tapes combine 3M high-performance acrylic adhesive with highly conductive ceramic particles for an extremely reliable and user-friendly thermal interface. They also offer a highly conformable construction that provides excellent wet-out on surfaces.
The thermally conductive interface pads provide high levels of conductivity for the most demanding electronics applications. They also provide excellent handling and can be die-cut to fit most applications.
The thermally conductive epoxies have a range of liquid adhesives with minimal odor and superior structural strength adhesion. The adhesive flows and fills micro-spaces on surfaces and the ultra-thin bond line helps achieve low thermal impedance. See all tape.