The 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 (or 3M Scotch-Weld Epoxy Potting Compound/Adhesive 270 B/A) is a two-part, low-viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components, and is available in clear or black. Scotch-Weld epoxy potting compound/adhesive DP270 is noncorrosive to copper, and offers good thermal shock resistance and excellent retention of electrical insulation properties under high-humidity conditions.
Scotch-Weld epoxy potting compound/adhesive DP270 has a work life of approximately 70 minutes, a tack-free time of about 3 hours, and is fully cured after 48 hours at 73°F (23°C). This product produces no exotherm in 5-10 gram masses, and a very slight exotherm in larger masses.
Scotch-Weld epoxy potting compound/adhesive DP270 is ideal for the potting and encapsulation of many heat-sensitive or delicate components such as glass diodes and sensors, as well as for transformers, coils, chokes, relays, and more.
- Good thermal-shock resistance
- Meets UL 94 HB (file no. E61941)
- Long work life
- Excellent electrical properties
- Noncorrosive to copper
- Negligible exotherm