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Results: 1 - 3 of 3 |
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Supplier: Hysol
Subtitle:
2 Part Epoxy Potting Compound
Description:
The Hysol® ES2500™ is a resilient, fast gelling potting compound. Designed for easy 2 to 1 meter-mix-dispense machinery and low abrasion. This material is ideal for potting and encapsulating high volume parts. Meets UL 94 HB Flame Retardant to 1.5mm thickness.
Category: Test, Tools, Other Products - Tapes, Adhesives - Glue, Adhesives, Applicators |
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Supplier: Hysol
Subtitle:
High Tg and Room Temperature Curing Fiber Optic Epoxy Adhesive
Description:
TRA-BOND F113SC is a room temperature curing, high Tg and low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors. It has also been used for bonding LED displays, lenses and other optical components. TRA-BOND F113SC provides both high bond strength as well as low str...
Category: Test, Tools, Other Products - Tapes, Adhesives - Glue, Adhesives, Applicators |
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Supplier: Hysol
Subtitle:
Room Temperature Conductive Silver Epoxy Adhesive
Description:
The TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. This two-part, smooth paste formulation of refined pure silver and epoxy is free of sol...
Category: Test, Tools, Other Products - Tapes, Adhesives - Glue, Adhesives, Applicators |

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