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TE Connectivity
822516 Series
TE Connectivity
Diplomate DL Series
TE Connectivity
Sockets for ICs, Transistors
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Diplomate DL Series

IC Sockets

TE Connectivity

The Diplomate Dual Leaf (DL) DIP and SIP socket families provide superior handling characteristics.

Product Description

These stackable housings feature a "true closed bottom" design which prevents solder or flux wicking at class 1 conditions of EIA 486. Standoffs provide board clearance for proper cleaning after soldering. The Diplomate DL DIP and SIP Socket families meet the requirements of EIA RS-415, MIL-S-83734 and the most stringent specifications of main-frame computer manufacturers.

DIP and SIP Sockets
  • Dual Leaf contacts for high reliability and constant, low resistance
  • Anti-overstress prevents contact damage
SIP Sockets
  • Low profile 0.210" (5.33mm) maximum seating plane above PC board
  • Large target area with tapered lead-in ramps for easy SIP insertion
  • Stackable end-to-end and side-to-side high board density
  • Housing standoffs and slots facilitate board cleaning
  • Contact Finish - Mating:Tin
  • Contact Finish - Post:Tin
  • Contact Material - Mating:Beryllium Copper
  • Contact Material - Post:Beryllium Copper
  • Features:Closed Frame
  • Housing Material:Thermoplastic, Glass Filled
  • Material Flammability Rating:UL94 V-0
  • Mounting Type:Through Hole
  • Number of Positions or Pins (Grid):16 (1 x 16)
  • Operating Temperature:-55°C ~ 105°C
  • Packaging:Tube
  • Pitch - Mating:0.100" (2.54mm)
  • Pitch - Post:0.100" (2.54mm)
  • Termination:Solder
  • Termination Post Length:0.130" (3.30mm)
  • Type:SIP
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TE Connectivity's Diplomate DL Series Sockets