Devices that are used to provide cooling to electrical and electronic components.
DC Fans
Cooling devices that are designed to produce a flow of air out of one side or end of the unit. The devices in this family are designed to be used with a direct current.
AC Fans
Cooling devices that are designed to produce a flow of air out of one side or end of the unit. The devices in this family are designed to be used with an alternating current.
Pads, Sheets
Devices that are designed to secure and/or provide for enhanced thermal transfer between heat sinks and components. The items in this family are in the form of a thin, cuttable, rectangular, flexible sheets. Some of these items may be precut to fit on predefined component sizes.
Adhesives, Epoxies, Greases, Pastes
Devices that are designed to secure and/or provide for enhanced thermal transfer between heat sinks and components. The items in this family are in a spreadable semi-liquid state.
Thermoelectric, Peltier Assemblies
Devices that are designed for thermal transfer using the Peltier effect (as current passes through the junction of two different metals or semiconductors, heat is produced on one side of the junction and absorbed on the other side). The items in this family will contain a Peltier module, heat sinks and may also contain a fan.
Thermoelectric, Peltier Modules
Devices that are designed for thermal transfer using the Peltier effect (as current passes through the junction of two different metals or semiconductors, heat is produced on one side of the junction and absorbed on the other side).