Winbond Electronics Corp.

- Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond's major products include specialty DRAM, mobile RAM, NOR Flash and graphics DRAM with revenues in 2010 of approximately one billion US dollars. Winbond has around 1,800 employees worldwide, with offices in Taiwan, Hong Kong, Japan, and the USA. For more information, please visit: www.winbond.com. 

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Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions offering Serial and Parallel Flash, Specialty DRAM, Mobile RAM and Graphics DRAM. Winbond manufactures memories in the company’s state of the art 12” wafer fabrication facility at its headquarters in Taichung, Taiwan and has approximately 1,800 employees worldwide, with offices in Taiwan, Hong Kong, Japan, and USA. Markets supported include communications, consumer, computers, automotive and industrial applications.

Winbond offers a full line of SPI(Serial Peripheral Interface), DualSPI, QuadSPI and QPI(Quad Peripheral Interface) Serial Flash products from 1Mb through 256Mb densities in 3V, 2.5V and 1.8V in industry standard packages. A complimentary industry standard compatible GL family of Parallel Flash products is also offered from 32Mb through 256Mb densities.

Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities from 1M to 256M-bit, small erasable sectors and the industry's highest performance. The W25X family supports Dual-SPI effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the 25X family with Dual-I/O and Quad-I/O SPI for even higher performance. Clock rates up to 104MHz achieve an equivalent of 416MHz (50M-Byte/S transfer rate) when using Quad-SPI. This is more than eight times the performance of ordinary Serial Flash (50MHz) and even surpasses asynchronous Parallel Flash memories while using fewer pins and less space. Faster transfer rates mean controllers can execute code (XIP) directly from the SPI interface or further improve boot time when shadowing code to RAM. Additionally, some SpiFlash devices offer the new Quad Peripheral Interface (QPI) supporting true Quad Commands for improved XIP performance and simpler controller circuitry.

Winbond’s W29GL family of 3-Volt Page-Mode Parallel Flash memories are offered in densities from 32Mb to 256Mb and support industry standard interfaces, architectures and packages. They are drop-in replacements to the popular “x29GL” products available in the industry, with no firmware change. The W29GL family also offers faster program and erase times, which can improve production throughput and enable faster firmware updates. Winbond’s Parallel Flash products are ideal for a wide variety of applications requiring the higher performance of a parallel bus width and page mode operation.

Fulfilling customer’s needs by offering high quality product solutions, technical support and a stable supply, Winbond continues its innovation and leadership in low pin count Serial Flash for code storage applications.

On DRAM memory products, Winbond is focusing on the non-PC main memory and mobile DRAM market. Winbond offers various SDR, DDR, mobile SDR and mobile DDR products in x16 and x32 organizations. All DRAM products meet the JEDEC standard and are compatible to products from other DRAM suppliers.

Winbond specialty DRAMs are offered from 16Mb to 256Mb SDR with speeds up to 200MHz, 32Mb to 256Mb DDR with speeds up to 250MHz, 128Mb to 2Gb DDR2 with speeds up to 1066Mbps, and 1Gb to 2Gb DDR3. All DRAM products are offered in commercial, industrial and automotive temperature ranges. Winbond also offers 128Mb to 512Mb mobileSDR and mobileDDR along with 512Mb and 2Gb mobileDDR2 products. We provide stable and long term support on medium and low density Specialty DRAM and mobile products. Winbond is one of the world’s major DRAM suppliers.
Winbond Electronics Corp.
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