Wakefield - Established in 1957, Wakefield Engineering designs efficient, affordable and reliable thermal management solutions for a diverse range of commercial, industrial, and military markets. Recognized as a worldwide leader, Wakefield Engineering has grown with the market while expanding into others, responding to technological advances and anticipating industry demands. Wakefield Engineering is a wholly owned subsidiary of Alpha Technologies Group, Inc.
Digi-Key’s library of more than 2000 exclusive PTM Online… On Demand® product training modules is a collection of training tools created with you – the busy design engineer – in mind. They are provided with the cooperation of participating supplier partners. From this one source, you can learn about the latest products and technologies, download datasheets, check inventory, contact our technical staff, and place an order for same-day shipment.
These modules are available in audio and non-audio formats and listed by supplier in easy-to-find alphabetical order. Simply locate the module that interests you and click on your format of choice. We hope you find these tools useful, and with new modules added continuously, we invite you to stop back often to see what’s new.
Product Training Modules Online...On Demand® is a registered trademark of Digi-Key Corporation.
= Updated Product Training Module - PTM
= New Product Training Module - PTM
To view modules, you will need Adobe Flash Player 9, or greater, installed on your computer. Adobe Flash Player is available FREE from Adobe.
Flash Player | Flash Player Support Center
|Wedgelocks B, C, D, Series - Wedgelock card retainers offer the highest locking force available for cold wall applications. In a typical application they will mount either directly to the PCB or to a heat frame assembly with screws or rivets and are then inserted into a machined channel of a cold wall within a rugged enclosure. When expanded, the wedgelock will clamp the PCB in place providing resistance to shock and vibration, as well as a thermal path for heat transfer between the PCB and the cold wall.
|Low to High Fin Density Extrusions for Power Semiconductors - Extruded heat-sinks are the most common heatsink used for thermal management today. They are manufactured by pushing hot aluminum billets through a steel die to produce the final shape. The most common aluminum alloy is 6063-T5, but other 6XXX alloys can also be examined as needed. When the material is extruded, the initial sticks are 30-40 feet in length and are very soft.
|901-910 Series Clip-Chip Heat Sinks - Wakefield-Vette’s 901-910 heat sink series supports the thermal cooling needs for chipsets manufactured by Intel, Broadcom, Motorola, TI, and more. A range of chip footprints from 19 mm to 40 mm has been developed. The product is a six-piece unit including the heat sink, clip, and four-springs mounting device which are combined into one unit and allows for easy assembly onto the chip-set by using the space that is between the PCB and the substrate of the solder balls.
|19000 Series Heatsinks - Wakefield offers five different models of the 19000 series, each designed for a different maximum power rating and expected temperature rise above ambient. Options range from a maximum 14.7°C rise for a 4.5 W power rating to a maximum 29.2°C rise for a 42.8 W power rating.
BGA Heat Sinks
Wakefield’s BGA Heat Sink catalog includes a number of new products for BGAs, Super BGAs, PBGAs and FPBGAs. Applications include Network routers and switches, high resolution printers, digital cameras, video games, DVD and global positioning systems (GPS).
Stamped Heat Sinks for Low Power Devices
Wakefield offers a wide range of board level power semiconductor heat sinks for surface mount and thru hole devices. This catalog contains a number of new devices.
DC/DC Converter Heat Sinks
Wakefield offers a comprehensive line of DC/DC converter heat sinks for quarter, half and full brick sizes. These heat sinks are designed with anchoring slots to accommodate various mounting requirements and both natural and forced air convection installations.
Bonded Fin Heat Sinks
Wakefield has greatly expanded its line of high performance Bonded Fin heat sinks and now includes 20 available shapes for use with IGBTs, power modules, SCRs and other high power electronic components. Bonded fin products can be easily configured as maxiTHERM-HD3™ forced convection or natural convection assemblies.
|RoHS Compliance Plan
RoHS Compliance Part(s) Search
Compliance with the RoHS Directive is essential to Wakefield’s ability to continue to do business with European Union customers after July 1, 2006.
More about Wakefield
Headquartered in Pelham, New Hampshire and with support from channel partners, sales teams, and manufacturing across the globe. Wakefield Thermal Solutions, ISO 9001:2000 certified, has been excelling and will continue to succeed in not only offering thermal solutions, but in all sorts of industry. Our resources with our subsidiary companies allow us not only to compliment our products, but also make the buying process for a variety of difficult products that much easier for our customers.
We serve the following industries:
• Lighting / LED
• Building & construction
• Hardware / machinery
• Computer hardware- racks, enclosures, face plates
• Solar industries
• Alternative energy applications
Wakefield Thermal Solutions manufactured products include:
• Heat sinks- extruded, bonded and swedged fins
• Heat frames, liquid cold plates, compression clamps and spring assemblies
• Solar panel frames and assembled components
• Enclosures, face plates, front panels, computer cabinets
• Interior and exterior LED lighting
• Curtain wall, door and window profiles
• Louvers, heating vents, skylights, walkways and greenhouse structures
• Awnings, bleachers, railings, furniture, marine docks, and ramps
• Universal joints
• Powdered metal gears, over molded components
• Injection molded components
Corporate Headquarters - Pelham, NH