Advanced Thermal Solutions, Inc. - Advanced Thermal Solutions, Inc. (ATS) is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of air and liquid cooling solutions, laboratory-quality thermal instrumentation, along with thermal design consulting services and training.
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 Digi-Key’s library of more than 1700 exclusive PTM Online… On Demand® product training modules is a collection of training tools created with you – the busy design engineer – in mind. They are provided with the cooperation of participating supplier partners. From this one source, you can learn about the latest products and technologies, download datasheets, check inventory, contact our technical staff, and place an order for same-day shipment.
These modules are available in audio and non-audio formats and listed by supplier in easy-to-find alphabetical order. Simply locate the module that interests you and click on your format of choice. We hope you find these tools useful, and with new modules added continuously, we invite you to stop back often to see what’s new.
Product Training Modules Online...On Demand® is a registered trademark of Digi-Key Corporation.
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 | | maxiFLOW™ with maxiGRIP™ Heatsinks - Advanced Thermal Solution’s maxiFLOW™ design features a low-profile, spread-fin array that maximizes surface area for more effective convection (air) cooling. The maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB.
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 | | fanSINK™ Heat Sinks - Advanced Thermal Solutions fanSINK™ features a cross-cut, straight fin heat sink offering omni-directional air flow for optimum thermal performance independent of the PCB layout.
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 | | blueICE™ Heat Sinks - Advanced Thermal Solutions introduces a line of low profile, high performance heat sinks designed for cooling hot components in low airflow velocity conditions.
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Product Information
Advanced Thermal Design Solutions Center for ATS Heat Sinks
The ATS Thermal Design Solutions Center provides the most innovative solutions to thermal problems in the industry. We can help you understand how to best choose an ATS heat sink solution! ATS can address your problem with detailed thermal analysis that includes both experimental and computational simulations. We address the entire packaging domain that includes, component, circuit boards (PCBs), shelf (rack) and the entire system. ATS will conduct numerical / analytical modeling and simulations, to resolve your thermal issues.
Heat Sink Cheat Sheet
ATS Provides the most innovative solutions to thermal problems in the industry. We approach thermal challenges with detailed analysis that includes both experimental and computational simulations. We then address the entire packaging domain that includes component, circuit boards (PCBs), shelf (rack) and the entire system.
Advanced Thermal Solutions Thermal Instruments
Our industry leading instruments make it possible for our customer's to outfit an entire thermal lab or just purchase a cutting edge analytical instrument for a single project. Our consulting team will design a lab for you from equipment purchase, training classes and facilities development.
Controllers
Temperature & Velocity Measurement
Wind Tunnels
QoolPCB - A Fixed Cost Plan For PCB Level Cooling
Advanced Thermal Solutions, Inc., (ATS) is proud to roll out a new and first-of-its-kind plan that offers a cooling solution for all components on the board at a fixed, competitive cost. The FCBS plan eliminates the customers cost for design, selection, tooling, samples, verification, and supply chain management, since they are all included in the plan.
To learn more about the new QoolPCB design services program, click here. |
Product Training Presentations
Webinars
Advanced Thermal Solutions, Inc. (ATS) presents a variety of educational seminars on thermal management for all engineers, designers and program managers with an interest in electronics cooling. The online tutorials provide practical information on critical areas of thermal management to help optimize individual cooling solutions.
Each of the approximately one-hour tutorials focuses on a different topic in the critical arena of electronics thermal management and will include detailed visuals and narration by an ATS thermal management expert. |
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More about Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions, Inc (ATS) is a leading-edge engineering/manufacturing company focused on the thermal management of electronics. Founded in 1989 as a consulting company, ATS has evolved to a complete thermal solutions provider and is world renown for its portfolio of more than 450 high and ultra performance heat sinks, research-quality test equipment, and leading-edge R&D. In the interval of three years, ATS has established its own manufacturing center in the U.S., developed strategic partnerships with Asian manufacturers, and opened ATS-Europe, its sales and engineering office in Holland. As ATS has significantly increased its customer base, its product offerings have also expanded to include advanced fan trays, liquid cooling systems, advanced cooling systems and next-generation thermal test instruments. ATS is committed to providing the electronics industry with innovative, high-quality and cost-effective thermal management and packaging solutions. Their goal is to be their customers’ value-added supplier and success partner for all thermal and packaging needs - analysis, testing, and final product.
Manufacturing Capabilities
From its state-of-the-art, US-based rapid prototyping and production facilities to its multiple strategic partners positioned in Europe and Asia, ATS has the capability to meet virtually any metal fabrication requirement with dual sourcing options and ISO certified partners globally. ATS manufacturing in the U.S. boosts the latest machining centers and fin-milling facilities in order to produce tight fin-pitch tolerances in a cost-effective manner. In addition, the facilities support a unique RF brazing capability for the purpose of manufacturing ATS’ patent single-fin assembly technology that yields an unprecedented 67 fins per inch (26 fins per cm) for high-power, high-flow cooling applications.
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Documents of Interest
Qpedia: The Free On-Line Thermal Management Magazine for the Thermal Management Professional. The current issue is now available to Digi-Key Customers! Download
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The October 2012 issue covers: Basic Finite Volume Concepts in CFD, Micropumps - For Tomorrows;s Portabls Electronics, Thermoelectric Peltier Cooling, Heat Transfer Devices That use Liquid as a Coolant, and Cooling News Download |
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The May 2011 issue covers: ATCA Standards for Thermo-Mechanical Considerations, Miniature Refrigerator for a Laptop, Thermal Simulation and Management of 3D Stacked Chip, and JEDEC - Review of Standards on Compact Thermal Modeling. Download |
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The April 2011 issue covers: Application of Mist Cooling for Thermal Management, Thermal Management in Automobile, Piezoelectric Fans and their Application in Electronics Cooling, Thermal Management Strategies for High Heat Flux Electronic Devices. Download |
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The March 2011 issue covers: Advances in Thermal Interface Materials, Parameters Affecting Vapor Chamber Performance, Increasing the Convection Heat Transfer Coefficient, and Sub-Ambient Cooling of Microprocessors. Download |
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The January 2011 issue covers: Bendable heat Pipes, Dense Spray Cooled DC-DC Converters, Liquid Cooling Using Boiling and Condensation, Thermal Management in Automotives. Download |
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The December 2010 issue covers: Cooling Techniques, Heat Sink Selection Methods, Heat Transfer Coefficients in High Altitudes, TECs and Micro TECs for Spot Cooling Electronics, and Cooling News. Download |
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The November 2010 issue covers: Heat Spreading with Copper, Silicon and Heat Pipes, Electrohydrodynamic (EHD) Pumps, Multilayer Minichannel Heat Sinks, Heat Sink Manufacturing Technologies, Cooling News. Download |
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The October 2010 issue covers: Application of Air Jet Impingement in a 1-U System, Thermal Management of Defense Electronics, Strategies for CFD Modeling in Complex PCBs, and Cooling News. Download |
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The September 2010 issue covers: CFD Analysis of a Data Center, LED-Based Lighting Study, Multi-Chip Module Thermal Management, Spreading Resistance of Single and Multiple Heat Sources, and Cooling News. Download |
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The August 2010 issue covers: Low Temperature Refrigeration for Microprocessors, Improving Microchannel Heat Sinks, Designing a Miniature Scale Refrigeration System, Acoustic Refrigeration, and Cooling News. Download |
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The July 2010 issue covers: Evaporative Cooling in Thermal Management, Electro-Osmotic Pumps, Flow Bench Measurement of Fan and System Curves, magnetic Levitation Fans, and Cooling News. Download |
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The June 2010 issue covers: Using Thermoelectric Coolers in Electronics Cooling, How Fan Obstruction Affects Performance of Fans, Localized cooling Using Cold Plates, Two-Resistor Compact Modeling, and Cooling News. Download |
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The May 2010 issue covers: The Lock-on Phenomenon, Vortices and Vibration in Heat Transfer, Modeling of the Transient Thermal Response of Single-and Multi-Chip Packages, The Effects of Leakage Current in Electronics Thermal Management, Understanding and Optimizing Thermal Vias. Download
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The April 2010 issue covers: Jet Impingement Cooling, Part 2: Single Phase, Advanced MCs: Their Thermal Problems and Cooling Limitations, Use of Pool Boiling to Thermally Manage High Power Components, Cooling News, and Adaptive Cooling in Data Centers. Download |
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The March 2010 issue covers: Critical Heat Flux of Boiling in Microchannels, Long Term Thermal Grease Reliability, Using Silicon Microchannel Heat Sinks for Thermal Management, Tubing Material Selection for Liquid Cooling and Cooling News. Download |
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The February 2010 issue covers: Fundamentals of Magnetic-to-Fluid-Dynamic Pumps, Compact Heat Sink Modeling, Using the Stirling Cycle, Cooling News, and a Cabinet Cooling Case Study. Download |
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The January 2010 issue covers: Heat Spreaders, Microprocessor Power and Temperature Mapping, NEBS Compliance Testing, and Water Heating Using Solar Collectors. Download |
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The December 2009 issue covers: Fundamentals of Infrared Temperature Measurement, Characteristics of Two-Phase Flow in Microchannel Heat Sinks, Thermal Challenges in Automotive High Density Lithium-Ion Battery Packs and in Multi-Core Processors. Download |
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The November 2009 issue covers: Natural Convection in Vertical Channels, Thermal Issues in Stacked Die Packages, Heat Sink Transient Response, and General Methods for Measuring Thermal Conductivity. Download |
To view the October 2009 issue of Qpedia, archived back issues and new monthly issues click here for a one time registration. It's free and quick!
ATS News: News and information regarding Advanced Thermal Solutions products |
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